Oh; Yun-Jin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Oh; Yun-Jin.The latest application filed is for "semiconductor package having plural semiconductor chips and method of forming the same".
- Oh; Yun-Jin - Asan-si N/A KR
- Oh; Yun-Jin - Daejeon KR
- Oh; Yun-Jin - Jung-gu KR
| Patent | Date |
|---|---|
| Semiconductor package having plural semiconductor chips and method of forming the same Grant 8,664,780 - Han , et al. March 4, 2 | 2014-03-04 |
| Semiconductor Package Having Plural Semiconductor Chips And Method Of Forming The Same App 20130049221 - HAN; CHANG-HOON ; et al. | 2013-02-28 |
| Printed circuit board and semiconductor package including the same Grant 8,063,313 - Oh , et al. November 22, 2 | 2011-11-22 |
| Semiconductor package and method of manufacturing the same Grant 7,868,460 - Oh January 11, 2 | 2011-01-11 |
| Printed Circuit Board And Semiconductor Package Including The Same App 20090179335 - OH; Yun-Jin ; et al. | 2009-07-16 |
| Semiconductor package and method of manufacturing the same App 20080136044 - Oh; Yun-Jin | 2008-06-12 |
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