OH; Tac Keun

Patent Applications and Registrations

Patent applications and USPTO patent grants for OH; Tac Keun.The latest application filed is for "semiconductor packages including interposer and methods of manufacturing the same".

Company Profile

3.17.20

OH; Tac Keun - Seoul KR
Oh; Tac Keun - Seongnam-si N/A KR
- Gyeonggi-do KR
Oh; Tac Keun - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Packages Including Interposer And Methods Of Manufacturing The Same App 20170287734 - OH; Tac Keun ; et al.	2017-10-05
Semiconductor packages including interposer and methods of manufacturing the same Grant 9,716,017 - Oh , et al. July 25, 2	2017-07-25
Multi chip package and method for manufacturing the same Grant 9,570,370 - Oh , et al. February 14, 2	2017-02-14
Semiconductor Packages Including Interposer And Methods Of Manufacturing The Same App 20160379845 - OH; Tac Keun ; et al.	2016-12-29
Semiconductor package and method for manufacturing the same Grant 9,508,699 - Kim , et al. November 29, 2	2016-11-29
Semiconductor package and method for manufacturing the same Grant 9,406,584 - Lee , et al. August 2, 2	2016-08-02
Methods of fabricating semiconductor stack packages Grant 9,299,689 - Oh March 29, 2	2016-03-29
Stack packages including diffusion barriers over sidewalls of through via electrodes and methods of manufacturing the same Grant 9,257,413 - Yang , et al. February 9, 2	2016-02-09
Multi Chip Package And Method For Manufacturing The Same App 20150340303 - OH; Tac Keun ; et al.	2015-11-26
Semiconductor Package And Method For Manufacturing The Same App 20150311182 - LEE; Jeong Hwan ; et al.	2015-10-29
Semiconductor Package And Method For Manufacturing The Same App 20150303181 - KIM; Jong Hoon ; et al.	2015-10-22
Stack Packages And Methods Of Manufacturing The Same App 20150061120 - YANG; Seung Taek ; et al.	2015-03-05
Semiconductor Stack Packages And Methods Of Fabricating The Same App 20140335656 - OH; Tac Keun	2014-11-13
Semiconductor package Grant 8,803,327 - Oh August 12, 2	2014-08-12
Semiconductor chip and fabricating method thereof Grant 8,669,642 - Son , et al. March 11, 2	2014-03-11
Semiconductor Chip Module And Semiconductor Package Having The Same App 20140014958 - OH; Tac Keun ; et al.	2014-01-16
Semiconductor chip, stack-type semiconductor package Grant 8,624,241 - Oh January 7, 2	2014-01-07
Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same Grant 08618656 -	2013-12-31
Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same Grant 8,618,656 - Oh , et al. December 31, 2	2013-12-31
Semiconductor Package App 20130292844 - OH; Tac Keun	2013-11-07
Semiconductor Stack Packages And Methods Of Fabricating The Same App 20130154074 - OH; Tac Keun	2013-06-20
Wafer Level Chip Scale Package Having An Enhanced Heat Exchange Efficiency With An Emf Shield And A Method For Fabricating The Same App 20130078807 - PARK; Chang Jun ; et al.	2013-03-28
Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same Grant 8,338,921 - Park , et al. December 25, 2	2012-12-25
Semiconductor Chip And Fabricating Method Thereof App 20120205816 - SON; Ho Young ; et al.	2012-08-16
Stacked semiconductor package electrically connecting semiconductor chips using outer surfaces thereof and method for manufacturing the same Grant 8,198,136 - Oh June 12, 2	2012-06-12
Semiconductor Chip, Stack-type Semiconductor Package, And Method For Manufacturing The Same App 20120138925 - OH; Tac Keun	2012-06-07
Wafer Level Chip Scale Package Having An Enhanced Heat Exchange Efficiency With An Emf Shield And A Method For Fabricating The Same App 20120049385 - PARK; Chang Jun ; et al.	2012-03-01
Flexible Semiconductor Package Apparatus Having A Responsive Bendable Conductive Wire Member And A Manufacturing The Same App 20120013016 - OH; Tac Keun ; et al.	2012-01-19
Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same Grant 8,049,332 - Oh , et al. November 1, 2	2011-11-01
Stacked Semiconductor Package Electrically Connecting Semiconductor Chips Using Outer Surfaces Thereof And Method For Manufacturing The Same App 20110033978 - OH; Tac Keun	2011-02-10
Stacked semiconductor package electrically connecting semiconductor chips using outer surfaces thereof and method for manufacturing the same Grant 7,838,979 - Oh November 23, 2	2010-11-23
Flexible Semiconductor Package Apparatus Having A Responsive Bendable Conductive Wire Member And A Manufacturing The Same App 20100109140 - OH; Tac Keun ; et al.	2010-05-06
Stacked Semiconductor Package Electrically Connecting Semiconductor Chips Using Outer Surfaces Thereof And Method For Manufacturing The Same App 20090321954 - OH; Tac Keun	2009-12-31
Wafer Level Chip Scale Package Having An Enhanced Heat Exchange Efficiency With An Emf Shield And A Method For Fabricating The Same App 20090184414 - PARK; Chang Jun ; et al.	2009-07-23

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