loadpatents
name:-0.0065028667449951
name:-0.0019519329071045
name:-0.0010879039764404
Oh; Sunok Patent Filings

Oh; Sunok

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oh; Sunok.The latest application filed is for "method of analyzing copolycarbonate".

Company Profile
0.1.4
  • Oh; Sunok - Hwaseong-si KR
  • OH; Sunok - Daejeon KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Ultrasonic bonding apparatus and method for ultrasonic bonding using the same
Grant 11,446,878 - Park , et al. September 20, 2
2022-09-20
Method Of Analyzing Copolycarbonate
App 20220244235 - KIM; Hyo Yong ;   et al.
2022-08-04
Ultrasonic Bonding Apparatus And Method For Ultrasonic Bonding Using The Same
App 20220055313 - PARK; CHAN-JAE ;   et al.
2022-02-24
Display Panel And Manufacturing Method For Same
App 20220013517 - LEE; HYUN A ;   et al.
2022-01-13
Adhesive Member, Display Device Including The Same, And Method Of Fabricating Display Device
App 20210223818 - JANG; Daehwan ;   et al.
2021-07-22

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