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Patent applications and USPTO patent grants for Oh; Seon Woo.The latest application filed is for "coil electronic component".
Patent | Date |
---|---|
Inductor Grant 11,342,110 - Oh , et al. May 24, 2 | 2022-05-24 |
Coil Electronic Component App 20210027926 - Jeon; Hyung Jin ;   et al. | 2021-01-28 |
Coil Component And Manufacturing Method For The Same App 20200143976 - JEON; Hyung Jin ;   et al. | 2020-05-07 |
Inductor App 20190122810 - OH; Seon Woo ;   et al. | 2019-04-25 |
Chip Electronic Component Including Stress Buffer Layer App 20180061553 - JEON; Hyung Jin ;   et al. | 2018-03-01 |
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