Oh; Sang Hyuck
Patent Applications and Registrations
Patent applications and USPTO patent grants for Oh; Sang Hyuck.The latest application filed is for "fan-out semiconductor package".
- Oh; Sang Hyuck - Suwon-Si KR
- Oh; Sang-Hyuck - Seoul KR
- Oh; Sang Hyuck - Suwon KR
- Oh; Sang Hyuck - Gyunggi-do KR
- OH; Sang-Hyuck - Jeju-do KR
| Patent | Date |
|---|---|
| Fan-out semiconductor package Grant 10,756,044 - Oh A | 2020-08-25 |
| Fan-out Semiconductor Package App 20190172809 - OH; Sang Hyuck | 2019-06-06 |
| Systems, Devices And Methods For Fermenting Beverages App 20180072972 - Shin; Jong-Wook ; et al. | 2018-03-15 |
| Multi-layer Type Printed Circuit Board And Method Of Manufacturing The Same App 20140102767 - Kang; Myung Sam ; et al. | 2014-04-17 |
| Multilayer Type Coreless Substrate And Method Of Manufacturing The Same App 20140027156 - Kim; Ki Hwan ; et al. | 2014-01-30 |
| Method For Forming Plating Layer Of Printed Circuit Board App 20120055800 - MOON; Jeong Ho ; et al. | 2012-03-08 |
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