Oh; Nam Keun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Oh; Nam Keun.The latest application filed is for "touch sensor".
- Oh; Nam Keun - Suwon-Si KR
- Oh; Nam Keun - Suwon KR
- Oh; Nam-Keun - Daejeon KR
- Oh; Nam Keun - Gyunggi-do KR
- Oh; Nam-Keun - Yusung-gu KR
| Patent | Date |
|---|---|
| Touch sensor Grant 9,519,366 - Park , et al. December 13, 2 | 2016-12-13 |
| Touch sensor Grant 9,383,781 - Lee , et al. July 5, 2 | 2016-07-05 |
| Touch panel and fabricating method thereof Grant 9,152,260 - Chae , et al. October 6, 2 | 2015-10-06 |
| Method of manufacturing printed circuit board having bump Grant 8,986,555 - Kim , et al. March 24, 2 | 2015-03-24 |
| Touch Sensor App 20150041301 - LEE; Jin Uk ; et al. | 2015-02-12 |
| Method of manufacturing a ball grid array substrate or a semiconductor chip package Grant 8,945,993 - Park , et al. February 3, 2 | 2015-02-03 |
| Single-layered printed circuit board and manufacturing method thereof Grant 8,889,994 - Kim , et al. November 18, 2 | 2014-11-18 |
| Touch Sensor App 20140333855 - Park; Jang Ho ; et al. | 2014-11-13 |
| Touch Panel And Fabricating Method Thereof App 20140176821 - Chae; Kyoung Soo ; et al. | 2014-06-26 |
| Touch Panel App 20140069692 - Park; Jang Ho ; et al. | 2014-03-13 |
| Method Of Manufacturing A Ball Grid Array Substrate Or A Semiconductor Chip Package App 20140017855 - PARK; Jung Hyun ; et al. | 2014-01-16 |
| Ball grid array substrate with insulating layer and semiconductor chip package Grant 8,546,943 - Park , et al. October 1, 2 | 2013-10-01 |
| Board On Chip Package Substrate And Manufacturing Method Thereof App 20120244662 - KIM; Ji-Eun ; et al. | 2012-09-27 |
| Single-layered Printed Circuit Board And Manufacturing Method Thereof App 20110186342 - KIM; Young-Ji ; et al. | 2011-08-04 |
| Board On Chip Package Substrate And Manufacturing Method Thereof App 20110110058 - KIM; Ji-Eun ; et al. | 2011-05-12 |
| Method Of Manufacturing Printed Circuit Board Having Bump App 20110100952 - KIM; Ji-Eun ; et al. | 2011-05-05 |
| Ball grid array substrate, semiconductor chip package and method of manufacturing the same App 20110095425 - Park; Jung Hyun ; et al. | 2011-04-28 |
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