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System-in-package module Grant 11,398,454 - Jang , et al. July 26, 2 | 2022-07-26 |
Embedded Multi-die Interconnect Bridge With Improved Power Delivery App 20220230993 - Liu; Hui ;   et al. | 2022-07-21 |
Memory Device Comprising Programmable Command-and-address And/or Data Interfaces App 20220172760 - Shaeffer; Ian ;   et al. | 2022-06-02 |
Integrated circuit that applies different data interface terminations during and after write data reception Grant 11,349,478 - Oh , et al. May 31, 2 | 2022-05-31 |
Semiconductor Package App 20220165721 - LEE; Manho ;   et al. | 2022-05-26 |
Embedded Multi-die Interconnect Bridge With Improved Power Delivery App 20220149029 - LIU; Hui ;   et al. | 2022-05-12 |
Semiconductor Package App 20220139879 - PARK; WANSOO ;   et al. | 2022-05-05 |
Semiconductor device package Grant 11,309,280 - Kim , et al. April 19, 2 | 2022-04-19 |
Semiconductor Package And Method Of Manufacturing The Same App 20220059505 - SONG; EUNSEOK ;   et al. | 2022-02-24 |
Inspection system and method for inspecting semiconductor package, and method of fabricating semiconductor package Grant 11,257,723 - Kim , et al. February 22, 2 | 2022-02-22 |
Semiconductor Package App 20220045038 - AN; Hee Woo ;   et al. | 2022-02-10 |
Memory device comprising programmable command-and-address and/or data interfaces Grant 11,211,105 - Shaeffer , et al. December 28, 2 | 2021-12-28 |
Chip On Film Package And Display Device Including The Same App 20210398870 - HWANG; Seung-Tae ;   et al. | 2021-12-23 |
Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics Grant 11,205,637 - Kim , et al. December 21, 2 | 2021-12-21 |
Semiconductor Package App 20210384161 - Song; Eunseok ;   et al. | 2021-12-09 |
Structure For Delivering Power App 20210329774 - Oh; Kyung Suk ;   et al. | 2021-10-21 |
Chip on film package and display device including the same Grant 11,107,743 - Hwang , et al. August 31, 2 | 2021-08-31 |
Structure for delivering power Grant 11,083,077 - Oh , et al. August 3, 2 | 2021-08-03 |
On-Die Termination of Address and Command Signals App 20210225417 - Shaeffer; Ian ;   et al. | 2021-07-22 |
Receiver with clock recovery circuit and adaptive sample and equalizer timing Grant 11,063,791 - Lin , et al. July 13, 2 | 2021-07-13 |
Semiconductor Package For Discharging Heat Generated By Semiconductor Chip App 20210202352 - KIM; Hyunki ;   et al. | 2021-07-01 |
Semiconductor Package And Method Of Fabricating The Same App 20210175199 - Song; Eunseok ;   et al. | 2021-06-10 |
Semiconductor Package App 20210167040 - YOU; SE-HO ;   et al. | 2021-06-03 |
Image sensor Grant 11,018,173 - Kim , et al. May 25, 2 | 2021-05-25 |
System-in-package Module App 20210118848 - JANG; Ae-Nee ;   et al. | 2021-04-22 |
Semiconductor package for discharging heat generated by semiconductor chip Grant 10,978,374 - Kim , et al. April 13, 2 | 2021-04-13 |
On-die termination of address and command signals Grant 10,971,201 - Shaeffer , et al. April 6, 2 | 2021-04-06 |
Semiconductor package and method of manufacturing the same Grant 10,964,618 - Lee , et al. March 30, 2 | 2021-03-30 |
Method Of Fabricating A Semiconductor Package App 20210082824 - YU; Hae-Jung ;   et al. | 2021-03-18 |
On-die termination control Grant 10,944,400 - Oh , et al. March 9, 2 | 2021-03-09 |
Substrate Assembly Semiconductor Package Including The Same And Method Of Manufacturing The Semiconductor Package App 20210057388 - OH; KYUNG SUK ;   et al. | 2021-02-25 |
Memory Device Comprising Programmable Command-and-address And/or Data Interfaces App 20210050043 - Shaeffer; Ian ;   et al. | 2021-02-18 |
Semiconductor Package App 20210005576 - Kim; Kyoungsoo ;   et al. | 2021-01-07 |
Semiconductor package and method of manufacturing semiconductor package Grant 10,879,225 - Kim , et al. December 29, 2 | 2020-12-29 |
Semiconductor Packages Having Improved Thermal Discharge And Electromagnetic Shielding Characteristics App 20200402952 - KIM; Won-keun ;   et al. | 2020-12-24 |
On-Die Termination of Address and Command Signals App 20200388310 - Shaeffer; Ian ;   et al. | 2020-12-10 |
Substrate assembly semiconductor package including the same and method of manufacturing the semiconductor package Grant 10,861,826 - Oh , et al. December 8, 2 | 2020-12-08 |
Semiconductor package and method of fabricating the same Grant 10,854,551 - Yu , et al. December 1, 2 | 2020-12-01 |
Inspection System And Method For Inspecting Semiconductor Package, And Method Of Fabricating Semiconductor Package App 20200373209 - KIM; Do-Hyun ;   et al. | 2020-11-26 |
On-die Termination Control App 20200358441 - Oh; Kyung Suk ;   et al. | 2020-11-12 |
Semiconductor Device Package App 20200343219 - KIM; Yong-hoon ;   et al. | 2020-10-29 |
Structure For Delivering Power App 20200329553 - Oh; Kyung Suk ;   et al. | 2020-10-15 |
Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics Grant 10,797,021 - Kim , et al. October 6, 2 | 2020-10-06 |
Chip On Film Package And Display Device Including The Same App 20200303276 - Hwang; Seung-Tae ;   et al. | 2020-09-24 |
On-die Termination Control App 20200287542 - Oh; Kyung Suk ;   et al. | 2020-09-10 |
Memory device comprising programmable command-and-address and/or data interfaces Grant 10,770,124 - Shaeffer , et al. Sep | 2020-09-08 |
Semiconductor package, package-on-package device, and method of fabricating the same Grant 10,756,015 - Lee , et al. A | 2020-08-25 |
Semiconductor chip and semiconductor package including the same Grant 10,748,871 - Oh , et al. A | 2020-08-18 |
Electronic device including semiconductor device package Grant 10,727,199 - Kim , et al. | 2020-07-28 |
On-die termination of address and command signals Grant 10,720,196 - Shaeffer , et al. | 2020-07-21 |
Semiconductor package Grant 10,699,983 - Kim , et al. | 2020-06-30 |
Receiver with Clock Recovery Circuit and Adaptive Sample and Equalizer Timing App 20200195475 - Lin; Qi ;   et al. | 2020-06-18 |
On-Die Termination of Address and Command Signals App 20200194042 - Shaeffer; Ian ;   et al. | 2020-06-18 |
Structure for delivering power Grant 10,674,597 - Oh , et al. | 2020-06-02 |
Semiconductor Package And Method Of Manufacturing The Same App 20200168522 - Lee; Jang-woo ;   et al. | 2020-05-28 |
Transaction-based on-die termination Grant 10,651,849 - Oh , et al. | 2020-05-12 |
Semiconductor Package And Method Of Manufacturing Semiconductor Package App 20200135710 - KIM; Won-Keun ;   et al. | 2020-04-30 |
Semiconductor Package, Package-on-package Device, And Method Of Fabricating The Same App 20200111738 - Lee; Seokhyun ;   et al. | 2020-04-09 |
Semiconductor Packages Having Improved Thermal Discharge And Electromagnetic Shielding Characteristics App 20200075545 - KIM; Won-keun ;   et al. | 2020-03-05 |
Substrate Assembly Semiconductor Package Including The Same And Method Of Manufacturing The Semiconductor Package App 20200075551 - OH; KYUNG SUK ;   et al. | 2020-03-05 |
Semiconductor Package App 20200027818 - Kim; Hyunki ;   et al. | 2020-01-23 |
Semiconductor package, package-on-package device, and method of fabricating the same Grant 10,541,201 - Lee , et al. Ja | 2020-01-21 |
Receiver with clock recovery circuit and adaptive sample and equalizer timing Grant 10,536,304 - Lin , et al. Ja | 2020-01-14 |
Image Sensor App 20190386050 - KIM; JI-HWANG ;   et al. | 2019-12-19 |
On-die termination of address and command signals Grant 10,510,388 - Shaeffer , et al. Dec | 2019-12-17 |
Semiconductor Package, Package-on-package Device, And Method Of Fabricating The Same App 20190378795 - LEE; Seokhyun ;   et al. | 2019-12-12 |
On-die Termination Control App 20190348985 - Oh; Kyung Suk ;   et al. | 2019-11-14 |
Semiconductor Chip And Semiconductor Package Including The Same App 20190295986 - OH; SEONG HWAN ;   et al. | 2019-09-26 |
Semiconductor Package App 20190295917 - KIM; Kil-soo ;   et al. | 2019-09-26 |
Semiconductor Package And Method Of Fabricating The Same App 20190244905 - YU; Hae-Jung ;   et al. | 2019-08-08 |
Memory Device Comprising Programmable Command-and-address And/or Data Interfaces App 20190206458 - Shaeffer; Ian ;   et al. | 2019-07-04 |
Electronic Device Including Semiconductor Device Package App 20190148337 - KIM; Yong-hoon ;   et al. | 2019-05-16 |
On-Die Termination of Address and Command Signals App 20190130952 - Shaeffer; Ian ;   et al. | 2019-05-02 |
Memory component with on-die termination Grant 10,270,442 - Oh , et al. | 2019-04-23 |
Changing settings for a transient period associated with a deterministic event Grant 10,268,252 - Chang , et al. | 2019-04-23 |
On-die Termination Control App 20190052269 - Oh; Kyung Suk ;   et al. | 2019-02-14 |
Memory device comprising programmable command-and-address and/or data interfaces Grant 10,192,598 - Shaeffer , et al. Ja | 2019-01-29 |
On-die termination of address and command signals Grant 10,115,439 - Shaeffer , et al. October 30, 2 | 2018-10-30 |
Embedded Multi-die Interconnect Bridge With Improved Power Delivery App 20180240778 - Liu; Hui ;   et al. | 2018-08-23 |
On-die termination control Grant 10,056,902 - Oh , et al. August 21, 2 | 2018-08-21 |
Structure For Delivering Power App 20180235077 - Oh; Kyung Suk ;   et al. | 2018-08-16 |
Changing Settings For A Transient Period Associated With A Deterministic Event App 20180196489 - Chang; Yu ;   et al. | 2018-07-12 |
Magnetically decoupled inductor structures Grant 9,941,201 - Jiang , et al. April 10, 2 | 2018-04-10 |
Power line layout in integrated circuits Grant 9,935,052 - Liu , et al. April 3, 2 | 2018-04-03 |
On-die Capacitor (odc) Structure App 20180083091 - Oh; Kyung Suk ;   et al. | 2018-03-22 |
Structure for delivering power Grant 9,913,363 - Oh , et al. March 6, 2 | 2018-03-06 |
On-Die Termination of Address and Command Signals App 20180053540 - Shaeffer; Ian ;   et al. | 2018-02-22 |
Memory Device Comprising Programmable Command-and-address And/or Data Interfaces App 20180047436 - Shaeffer; Ian ;   et al. | 2018-02-15 |
Changing settings for a transient period associated with a deterministic event Grant 9,870,040 - Chang , et al. January 16, 2 | 2018-01-16 |
On-die capacitor (ODC) structure Grant 9,859,358 - Oh , et al. January 2, 2 | 2018-01-02 |
Method to optimize general-purpose input/output interface pad assignments for integrated circuit Grant 9,842,181 - Oh , et al. December 12, 2 | 2017-12-12 |
Reducing unwanted reflections in source-terminated channels Grant 9,836,428 - Oh , et al. December 5, 2 | 2017-12-05 |
Receiver with Clock Recovery Circuit and Adaptive Sample and Equalizer Timing App 20170338979 - Lin; Qi ;   et al. | 2017-11-23 |
On-die Termination Control App 20170331477 - Oh; Kyung Suk ;   et al. | 2017-11-16 |
Circuitry and methods for measuring and correcting duty-cycle distortion Grant 9,818,471 - Oh , et al. November 14, 2 | 2017-11-14 |
Systems and methods for reducing power supply noise or jitter Grant 9,748,934 - Oh , et al. August 29, 2 | 2017-08-29 |
Memory device comprising programmable command-and-address and/or data interfaces Grant 9,734,879 - Shaeffer , et al. August 15, 2 | 2017-08-15 |
On-die termination of address and command signals Grant 9,721,629 - Shaeffer , et al. August 1, 2 | 2017-08-01 |
On-Die Termination of Address and Command Signals App 20170169878 - Shaeffer; Ian ;   et al. | 2017-06-15 |
On-die termination control Grant 9,660,648 - Oh , et al. May 23, 2 | 2017-05-23 |
Receiver with Clock Recovery Circuit and Adaptive Sample and Equalizer Timing App 20170054576 - Lin; Qi ;   et al. | 2017-02-23 |
On-die termination of address and command signals Grant 9,570,129 - Shaeffer , et al. February 14, 2 | 2017-02-14 |
On-die Capacitor (odc) Structure App 20160351654 - Oh; Kyung Suk ;   et al. | 2016-12-01 |
On-Die Termination of Address and Command Signals App 20160293236 - Shaeffer; Ian ;   et al. | 2016-10-06 |
Circuitry and methods for measuring and correcting duty-cycle distortion Grant 9,461,631 - Oh , et al. October 4, 2 | 2016-10-04 |
Receiver with clock recovery circuit and adaptive sample and equalizer timing Grant 9,455,825 - Lin , et al. September 27, 2 | 2016-09-27 |
On-die Termination Control App 20160233863 - Oh; Kyung Suk ;   et al. | 2016-08-11 |
Changing Settings For A Transient Period Associated With A Deterministic Event App 20160209902 - Chang; Yu ;   et al. | 2016-07-21 |
Receiver with Clock Recovery Circuit and Adaptive Sample and Equalizer Timing App 20160142200 - Lin; Qi ;   et al. | 2016-05-19 |
Timing calibration for multimode I/O systems Grant 9,342,095 - Oh , et al. May 17, 2 | 2016-05-17 |
Controlling a flash device having time-multiplexed, on-die-terminated signaling interface Grant 9,337,835 - Oh , et al. May 10, 2 | 2016-05-10 |
Changing settings for a transient period associated with a deterministic event Grant 9,304,568 - Chang , et al. April 5, 2 | 2016-04-05 |
Nonvolatile memory with chip-select/device-address triggered on-die termination Grant 9,306,565 - Oh , et al. April 5, 2 | 2016-04-05 |
Memory device with programmed device address and on-die-termination Grant 9,306,567 - Oh , et al. April 5, 2 | 2016-04-05 |
Nonvolatile memory device with on-die control and data signal termination Grant 9,306,564 - Oh , et al. April 5, 2 | 2016-04-05 |
Nonvolatile memory with command-driven on-die termination Grant 9,306,566 - Oh , et al. April 5, 2 | 2016-04-05 |
Controlling on-die termination in a nonvolatile memory Grant 9,306,568 - Oh , et al. April 5, 2 | 2016-04-05 |
On-die termination of address and command signals Grant 9,299,407 - Shaeffer , et al. March 29, 2 | 2016-03-29 |
Controlling a Flash Device Having Time-Multiplexed, On-Die-Terminated Signaling Interface App 20160005489 - Oh; Kyung Suk ;   et al. | 2016-01-07 |
Techniques relating to phase-locked loop circuits Grant 9,231,601 - Oh , et al. January 5, 2 | 2016-01-05 |
Nonvolatile memory device with time-multiplexed, on-die-terminated signaling interface Grant 9,225,328 - Oh , et al. December 29, 2 | 2015-12-29 |
Memory Device Comprising Programmable Command-and-address And/or Data Interfaces App 20150332746 - Shaeffer; Ian ;   et al. | 2015-11-19 |
Receiver with clock recovery circuit and adaptive sample and equalizer timing Grant 9,178,688 - Lin , et al. November 3, 2 | 2015-11-03 |
Structure For Delivering Power App 20150305141 - Oh; Kyung Suk ;   et al. | 2015-10-22 |
Buffered memory module having multi-valued on-die termination Grant 9,166,583 - Oh , et al. October 20, 2 | 2015-10-20 |
Integrated circuit system with dynamic decoupling and method of manufacture thereof Grant 9,153,572 - Oh , et al. October 6, 2 | 2015-10-06 |
Controlling On-die Termination In A Nonvolatile Memory App 20150263733 - Oh; Kyung Suk ;   et al. | 2015-09-17 |
Command-triggered on-die termination Grant 9,135,206 - Oh , et al. September 15, 2 | 2015-09-15 |
Memory Device With Programmed Device Address And On-die-termination App 20150249451 - Oh; Kyung Suk ;   et al. | 2015-09-03 |
Nonvolatile Memory With Command-driven On-die Termination App 20150244365 - Oh; Kyung Suk ;   et al. | 2015-08-27 |
Nonvolatile Memory With Chip-select/device-address Triggered On-die Termination App 20150244364 - Oh; Kyung Suk ;   et al. | 2015-08-27 |
Memory device comprising programmable command-and-address and/or data interfaces Grant 9,117,496 - Shaeffer , et al. August 25, 2 | 2015-08-25 |
Nonvolatile Memory Device With Time-multiplexed, On-die-terminated Signaling Interface App 20150236694 - Oh; Kyung Suk ;   et al. | 2015-08-20 |
Nonvolatile Memory Device With On-die Control And Data Signal Termination App 20150229306 - Oh; Kyung Suk ;   et al. | 2015-08-13 |
Reducing Unwanted Reflections in Source-Terminated Channels App 20150205751 - Oh; Kyung Suk ;   et al. | 2015-07-23 |
On-Die Termination of Address and Command Signals App 20150170724 - Shaeffer; Ian ;   et al. | 2015-06-18 |
Methods and systems for reducing supply and termination noise Grant 9,059,695 - Oh June 16, 2 | 2015-06-16 |
Command-triggered On-die Termination App 20150084672 - Oh; Kyung Suk ;   et al. | 2015-03-26 |
Multi-valued on-die termination Grant 8,981,811 - Oh , et al. March 17, 2 | 2015-03-17 |
Buffered Memory Module Having Multi-valued On-die Termination App 20150042378 - Oh; Kyung Suk ;   et al. | 2015-02-12 |
On-die termination of address and command signals Grant 8,947,962 - Shaeffer , et al. February 3, 2 | 2015-02-03 |
Power saving driver design Grant 8,922,245 - Oh , et al. December 30, 2 | 2014-12-30 |
Power saving driver design Grant 08922245 - | 2014-12-30 |
Integrated Circuits With On-Die Decoupling Capacitors App 20140374877 - Oh; Kyung Suk ;   et al. | 2014-12-25 |
Simultaneous switching noise cancellation by adjusting reference voltage and sampling clock phase Grant 8,878,592 - Oh November 4, 2 | 2014-11-04 |
Methods and Systems for Reducing Supply and Termination Noise App 20140285232 - Oh; Kyung Suk | 2014-09-25 |
Systems and methods for reducing power supply noise or jitter Grant 8,836,384 - Oh , et al. September 16, 2 | 2014-09-16 |
Changing Settings For A Transient Period Associated With A Deterministic Event App 20140258768 - Chang; Yu ;   et al. | 2014-09-11 |
Receiver with Clock Recovery Circuit and Adaptive Sample and Equalizer Timing App 20140169438 - Lin; Qi ;   et al. | 2014-06-19 |
On-Die Termination of Address and Command Signals App 20140112084 - Shaeffer; Ian ;   et al. | 2014-04-24 |
Signal lines with internal and external termination Grant 8,692,573 - Oh , et al. April 8, 2 | 2014-04-08 |
Methods and systems for reducing supply and termination noise Grant 8,692,574 - Oh April 8, 2 | 2014-04-08 |
Power Saving Driver Design App 20140043069 - Oh; Kyung Suk ;   et al. | 2014-02-13 |
Timing Calibration For Multimode I/o Systems App 20140019792 - Oh; Kyung Suk ;   et al. | 2014-01-16 |
Dynamic on-die termination selection Grant 8,610,455 - Oh , et al. December 17, 2 | 2013-12-17 |
Controlling on-die termination in a dynamic random access memory device Grant 8,610,459 - Oh , et al. December 17, 2 | 2013-12-17 |
Simultaneous Switching Noise Cancellation By Adjusting Reference Voltage And Sampling Clock Phase App 20130307607 - Oh; Kyung Suk | 2013-11-21 |
Multi-valued On-die Termination App 20130307584 - Oh; Kyung Suk ;   et al. | 2013-11-21 |
Asymmetric communication on shared links Grant 8,588,280 - Oh , et al. November 19, 2 | 2013-11-19 |
Balanced on-die termination Grant 8,588,012 - Wilson , et al. November 19, 2 | 2013-11-19 |
Receiver with clock recovery circuit and adaptive sample and equalizer timing Grant 8,548,110 - Lin , et al. October 1, 2 | 2013-10-01 |
Memory Device Comprising Programmable Command-and-address And/or Data Interfaces App 20130194854 - Shaeffer; Ian ;   et al. | 2013-08-01 |
Frequency responsive bus coding Grant 8,451,913 - Oh , et al. May 28, 2 | 2013-05-28 |
Integrated Circuit Device Timing Calibration App 20130076425 - Oh; Kyung Suk ;   et al. | 2013-03-28 |
Controlling On-die Termination In A Dynamic Random Access Memory Device App 20120265930 - Oh; Kyung Suk ;   et al. | 2012-10-18 |
Methods and Systems for Reducing Supply and Termination Noise App 20120182044 - Oh; Kyung Suk | 2012-07-19 |
Controlling dynamic selection of on-die termination Grant 8,188,762 - Oh , et al. May 29, 2 | 2012-05-29 |
Signal Lines With Internal And External Termination App 20120081146 - Oh; Kyung Suk ;   et al. | 2012-04-05 |
Signal lines with internal and external termination Grant 8,130,010 - Oh , et al. March 6, 2 | 2012-03-06 |
Integrated circuit device with dynamically selected on-die termination Grant 8,089,298 - Oh , et al. January 3, 2 | 2012-01-03 |
Balanced On-die Termination App 20110314200 - Wilson; John ;   et al. | 2011-12-22 |
Controlling Dynamic Selection Of On-die Termination App 20110267101 - Oh; Kyung Suk ;   et al. | 2011-11-03 |
Dynamic On-die Termination Selection App 20110241727 - Oh; Kyung Suk ;   et al. | 2011-10-06 |
Integrated Circuit Device With Dynamically Selected On-die Termination App 20110156750 - Oh; Kyung Suk ;   et al. | 2011-06-30 |
Signal Lines With Internal And External Termination App 20110128040 - Oh; Kyung Suk ;   et al. | 2011-06-02 |
Detachable Interconnect For Configurable Width Memory System App 20110119425 - Kollipara; Ravindranath ;   et al. | 2011-05-19 |
Frequency Responsive Bus Coding App 20110084737 - Oh; Kyung Suk ;   et al. | 2011-04-14 |
Memory controller that controls termination in a memory device Grant 7,924,048 - Oh , et al. April 12, 2 | 2011-04-12 |
Signal lines with internal and external termination Grant 7,915,912 - Oh , et al. March 29, 2 | 2011-03-29 |
Memory Controller That Controls Termination In A Memory Device App 20100315122 - Oh; Kyung Suk ;   et al. | 2010-12-16 |
Asymmetric Communication On Shared Links App 20100309964 - Oh; Kyung Suk ;   et al. | 2010-12-09 |
Memory-module buffer with on-die termination Grant 7,782,082 - Oh , et al. August 24, 2 | 2010-08-24 |
Signal Lines With Internal And External Termination App 20100073023 - Oh; Kyung Suk ;   et al. | 2010-03-25 |
Memory-module Buffer With On-die Termination App 20090284281 - Oh; Kyung Suk ;   et al. | 2009-11-19 |
Controlling memory devices that have on-die termination Grant 7,602,209 - Oh , et al. October 13, 2 | 2009-10-13 |
Integrated circuit with graduated on-die termination Grant 7,486,104 - Oh , et al. February 3, 2 | 2009-02-03 |
Controlling Memory Devices That Have On-die Termination App 20080315916 - Oh; Kyung Suk ;   et al. | 2008-12-25 |
Integrated Circuit With Graduated On-die Termination App 20070279084 - Oh; Kyung Suk ;   et al. | 2007-12-06 |
Circuits, systems and methods for dynamic reference voltage calibration Grant 7,236,894 - Oh , et al. June 26, 2 | 2007-06-26 |
Circuits, systems and methods for dynamic reference voltage calibration Grant 7,162,376 - Oh , et al. January 9, 2 | 2007-01-09 |
Circuits, systems and methods for dynamic reference voltage calibration App 20060142959 - Oh; Kyung Suk ;   et al. | 2006-06-29 |
Circuits, systems and methods for dynamic reference voltage calibration App 20060142977 - Oh; Kyung Suk ;   et al. | 2006-06-29 |