loadpatents
name:-0.11585998535156
name:-0.095992803573608
name:-0.043533086776733
Oh; Kyung Suk Patent Filings

Oh; Kyung Suk

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oh; Kyung Suk.The latest application filed is for "embedded multi-die interconnect bridge with improved power delivery".

Company Profile
41.99.105
  • Oh; Kyung Suk - Seongnam-si KR
  • Oh; Kyung Suk - Cupertino CA
  • Oh; Kyung Suk - Suwon-si KR
  • - Cupertino CA US
  • Oh; Kyung Suk - Campbell CA US
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
System-in-package module
Grant 11,398,454 - Jang , et al. July 26, 2
2022-07-26
Embedded Multi-die Interconnect Bridge With Improved Power Delivery
App 20220230993 - Liu; Hui ;   et al.
2022-07-21
Memory Device Comprising Programmable Command-and-address And/or Data Interfaces
App 20220172760 - Shaeffer; Ian ;   et al.
2022-06-02
Integrated circuit that applies different data interface terminations during and after write data reception
Grant 11,349,478 - Oh , et al. May 31, 2
2022-05-31
Semiconductor Package
App 20220165721 - LEE; Manho ;   et al.
2022-05-26
Embedded Multi-die Interconnect Bridge With Improved Power Delivery
App 20220149029 - LIU; Hui ;   et al.
2022-05-12
Semiconductor Package
App 20220139879 - PARK; WANSOO ;   et al.
2022-05-05
Semiconductor device package
Grant 11,309,280 - Kim , et al. April 19, 2
2022-04-19
Semiconductor Package And Method Of Manufacturing The Same
App 20220059505 - SONG; EUNSEOK ;   et al.
2022-02-24
Inspection system and method for inspecting semiconductor package, and method of fabricating semiconductor package
Grant 11,257,723 - Kim , et al. February 22, 2
2022-02-22
Semiconductor Package
App 20220045038 - AN; Hee Woo ;   et al.
2022-02-10
Memory device comprising programmable command-and-address and/or data interfaces
Grant 11,211,105 - Shaeffer , et al. December 28, 2
2021-12-28
Chip On Film Package And Display Device Including The Same
App 20210398870 - HWANG; Seung-Tae ;   et al.
2021-12-23
Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics
Grant 11,205,637 - Kim , et al. December 21, 2
2021-12-21
Semiconductor Package
App 20210384161 - Song; Eunseok ;   et al.
2021-12-09
Structure For Delivering Power
App 20210329774 - Oh; Kyung Suk ;   et al.
2021-10-21
Chip on film package and display device including the same
Grant 11,107,743 - Hwang , et al. August 31, 2
2021-08-31
Structure for delivering power
Grant 11,083,077 - Oh , et al. August 3, 2
2021-08-03
On-Die Termination of Address and Command Signals
App 20210225417 - Shaeffer; Ian ;   et al.
2021-07-22
Receiver with clock recovery circuit and adaptive sample and equalizer timing
Grant 11,063,791 - Lin , et al. July 13, 2
2021-07-13
Semiconductor Package For Discharging Heat Generated By Semiconductor Chip
App 20210202352 - KIM; Hyunki ;   et al.
2021-07-01
Semiconductor Package And Method Of Fabricating The Same
App 20210175199 - Song; Eunseok ;   et al.
2021-06-10
Semiconductor Package
App 20210167040 - YOU; SE-HO ;   et al.
2021-06-03
Image sensor
Grant 11,018,173 - Kim , et al. May 25, 2
2021-05-25
System-in-package Module
App 20210118848 - JANG; Ae-Nee ;   et al.
2021-04-22
Semiconductor package for discharging heat generated by semiconductor chip
Grant 10,978,374 - Kim , et al. April 13, 2
2021-04-13
On-die termination of address and command signals
Grant 10,971,201 - Shaeffer , et al. April 6, 2
2021-04-06
Semiconductor package and method of manufacturing the same
Grant 10,964,618 - Lee , et al. March 30, 2
2021-03-30
Method Of Fabricating A Semiconductor Package
App 20210082824 - YU; Hae-Jung ;   et al.
2021-03-18
On-die termination control
Grant 10,944,400 - Oh , et al. March 9, 2
2021-03-09
Substrate Assembly Semiconductor Package Including The Same And Method Of Manufacturing The Semiconductor Package
App 20210057388 - OH; KYUNG SUK ;   et al.
2021-02-25
Memory Device Comprising Programmable Command-and-address And/or Data Interfaces
App 20210050043 - Shaeffer; Ian ;   et al.
2021-02-18
Semiconductor Package
App 20210005576 - Kim; Kyoungsoo ;   et al.
2021-01-07
Semiconductor package and method of manufacturing semiconductor package
Grant 10,879,225 - Kim , et al. December 29, 2
2020-12-29
Semiconductor Packages Having Improved Thermal Discharge And Electromagnetic Shielding Characteristics
App 20200402952 - KIM; Won-keun ;   et al.
2020-12-24
On-Die Termination of Address and Command Signals
App 20200388310 - Shaeffer; Ian ;   et al.
2020-12-10
Substrate assembly semiconductor package including the same and method of manufacturing the semiconductor package
Grant 10,861,826 - Oh , et al. December 8, 2
2020-12-08
Semiconductor package and method of fabricating the same
Grant 10,854,551 - Yu , et al. December 1, 2
2020-12-01
Inspection System And Method For Inspecting Semiconductor Package, And Method Of Fabricating Semiconductor Package
App 20200373209 - KIM; Do-Hyun ;   et al.
2020-11-26
On-die Termination Control
App 20200358441 - Oh; Kyung Suk ;   et al.
2020-11-12
Semiconductor Device Package
App 20200343219 - KIM; Yong-hoon ;   et al.
2020-10-29
Structure For Delivering Power
App 20200329553 - Oh; Kyung Suk ;   et al.
2020-10-15
Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics
Grant 10,797,021 - Kim , et al. October 6, 2
2020-10-06
Chip On Film Package And Display Device Including The Same
App 20200303276 - Hwang; Seung-Tae ;   et al.
2020-09-24
On-die Termination Control
App 20200287542 - Oh; Kyung Suk ;   et al.
2020-09-10
Memory device comprising programmable command-and-address and/or data interfaces
Grant 10,770,124 - Shaeffer , et al. Sep
2020-09-08
Semiconductor package, package-on-package device, and method of fabricating the same
Grant 10,756,015 - Lee , et al. A
2020-08-25
Semiconductor chip and semiconductor package including the same
Grant 10,748,871 - Oh , et al. A
2020-08-18
Electronic device including semiconductor device package
Grant 10,727,199 - Kim , et al.
2020-07-28
On-die termination of address and command signals
Grant 10,720,196 - Shaeffer , et al.
2020-07-21
Semiconductor package
Grant 10,699,983 - Kim , et al.
2020-06-30
Receiver with Clock Recovery Circuit and Adaptive Sample and Equalizer Timing
App 20200195475 - Lin; Qi ;   et al.
2020-06-18
On-Die Termination of Address and Command Signals
App 20200194042 - Shaeffer; Ian ;   et al.
2020-06-18
Structure for delivering power
Grant 10,674,597 - Oh , et al.
2020-06-02
Semiconductor Package And Method Of Manufacturing The Same
App 20200168522 - Lee; Jang-woo ;   et al.
2020-05-28
Transaction-based on-die termination
Grant 10,651,849 - Oh , et al.
2020-05-12
Semiconductor Package And Method Of Manufacturing Semiconductor Package
App 20200135710 - KIM; Won-Keun ;   et al.
2020-04-30
Semiconductor Package, Package-on-package Device, And Method Of Fabricating The Same
App 20200111738 - Lee; Seokhyun ;   et al.
2020-04-09
Semiconductor Packages Having Improved Thermal Discharge And Electromagnetic Shielding Characteristics
App 20200075545 - KIM; Won-keun ;   et al.
2020-03-05
Substrate Assembly Semiconductor Package Including The Same And Method Of Manufacturing The Semiconductor Package
App 20200075551 - OH; KYUNG SUK ;   et al.
2020-03-05
Semiconductor Package
App 20200027818 - Kim; Hyunki ;   et al.
2020-01-23
Semiconductor package, package-on-package device, and method of fabricating the same
Grant 10,541,201 - Lee , et al. Ja
2020-01-21
Receiver with clock recovery circuit and adaptive sample and equalizer timing
Grant 10,536,304 - Lin , et al. Ja
2020-01-14
Image Sensor
App 20190386050 - KIM; JI-HWANG ;   et al.
2019-12-19
On-die termination of address and command signals
Grant 10,510,388 - Shaeffer , et al. Dec
2019-12-17
Semiconductor Package, Package-on-package Device, And Method Of Fabricating The Same
App 20190378795 - LEE; Seokhyun ;   et al.
2019-12-12
On-die Termination Control
App 20190348985 - Oh; Kyung Suk ;   et al.
2019-11-14
Semiconductor Chip And Semiconductor Package Including The Same
App 20190295986 - OH; SEONG HWAN ;   et al.
2019-09-26
Semiconductor Package
App 20190295917 - KIM; Kil-soo ;   et al.
2019-09-26
Semiconductor Package And Method Of Fabricating The Same
App 20190244905 - YU; Hae-Jung ;   et al.
2019-08-08
Memory Device Comprising Programmable Command-and-address And/or Data Interfaces
App 20190206458 - Shaeffer; Ian ;   et al.
2019-07-04
Electronic Device Including Semiconductor Device Package
App 20190148337 - KIM; Yong-hoon ;   et al.
2019-05-16
On-Die Termination of Address and Command Signals
App 20190130952 - Shaeffer; Ian ;   et al.
2019-05-02
Memory component with on-die termination
Grant 10,270,442 - Oh , et al.
2019-04-23
Changing settings for a transient period associated with a deterministic event
Grant 10,268,252 - Chang , et al.
2019-04-23
On-die Termination Control
App 20190052269 - Oh; Kyung Suk ;   et al.
2019-02-14
Memory device comprising programmable command-and-address and/or data interfaces
Grant 10,192,598 - Shaeffer , et al. Ja
2019-01-29
On-die termination of address and command signals
Grant 10,115,439 - Shaeffer , et al. October 30, 2
2018-10-30
Embedded Multi-die Interconnect Bridge With Improved Power Delivery
App 20180240778 - Liu; Hui ;   et al.
2018-08-23
On-die termination control
Grant 10,056,902 - Oh , et al. August 21, 2
2018-08-21
Structure For Delivering Power
App 20180235077 - Oh; Kyung Suk ;   et al.
2018-08-16
Changing Settings For A Transient Period Associated With A Deterministic Event
App 20180196489 - Chang; Yu ;   et al.
2018-07-12
Magnetically decoupled inductor structures
Grant 9,941,201 - Jiang , et al. April 10, 2
2018-04-10
Power line layout in integrated circuits
Grant 9,935,052 - Liu , et al. April 3, 2
2018-04-03
On-die Capacitor (odc) Structure
App 20180083091 - Oh; Kyung Suk ;   et al.
2018-03-22
Structure for delivering power
Grant 9,913,363 - Oh , et al. March 6, 2
2018-03-06
On-Die Termination of Address and Command Signals
App 20180053540 - Shaeffer; Ian ;   et al.
2018-02-22
Memory Device Comprising Programmable Command-and-address And/or Data Interfaces
App 20180047436 - Shaeffer; Ian ;   et al.
2018-02-15
Changing settings for a transient period associated with a deterministic event
Grant 9,870,040 - Chang , et al. January 16, 2
2018-01-16
On-die capacitor (ODC) structure
Grant 9,859,358 - Oh , et al. January 2, 2
2018-01-02
Method to optimize general-purpose input/output interface pad assignments for integrated circuit
Grant 9,842,181 - Oh , et al. December 12, 2
2017-12-12
Reducing unwanted reflections in source-terminated channels
Grant 9,836,428 - Oh , et al. December 5, 2
2017-12-05
Receiver with Clock Recovery Circuit and Adaptive Sample and Equalizer Timing
App 20170338979 - Lin; Qi ;   et al.
2017-11-23
On-die Termination Control
App 20170331477 - Oh; Kyung Suk ;   et al.
2017-11-16
Circuitry and methods for measuring and correcting duty-cycle distortion
Grant 9,818,471 - Oh , et al. November 14, 2
2017-11-14
Systems and methods for reducing power supply noise or jitter
Grant 9,748,934 - Oh , et al. August 29, 2
2017-08-29
Memory device comprising programmable command-and-address and/or data interfaces
Grant 9,734,879 - Shaeffer , et al. August 15, 2
2017-08-15
On-die termination of address and command signals
Grant 9,721,629 - Shaeffer , et al. August 1, 2
2017-08-01
On-Die Termination of Address and Command Signals
App 20170169878 - Shaeffer; Ian ;   et al.
2017-06-15
On-die termination control
Grant 9,660,648 - Oh , et al. May 23, 2
2017-05-23
Receiver with Clock Recovery Circuit and Adaptive Sample and Equalizer Timing
App 20170054576 - Lin; Qi ;   et al.
2017-02-23
On-die termination of address and command signals
Grant 9,570,129 - Shaeffer , et al. February 14, 2
2017-02-14
On-die Capacitor (odc) Structure
App 20160351654 - Oh; Kyung Suk ;   et al.
2016-12-01
On-Die Termination of Address and Command Signals
App 20160293236 - Shaeffer; Ian ;   et al.
2016-10-06
Circuitry and methods for measuring and correcting duty-cycle distortion
Grant 9,461,631 - Oh , et al. October 4, 2
2016-10-04
Receiver with clock recovery circuit and adaptive sample and equalizer timing
Grant 9,455,825 - Lin , et al. September 27, 2
2016-09-27
On-die Termination Control
App 20160233863 - Oh; Kyung Suk ;   et al.
2016-08-11
Changing Settings For A Transient Period Associated With A Deterministic Event
App 20160209902 - Chang; Yu ;   et al.
2016-07-21
Receiver with Clock Recovery Circuit and Adaptive Sample and Equalizer Timing
App 20160142200 - Lin; Qi ;   et al.
2016-05-19
Timing calibration for multimode I/O systems
Grant 9,342,095 - Oh , et al. May 17, 2
2016-05-17
Controlling a flash device having time-multiplexed, on-die-terminated signaling interface
Grant 9,337,835 - Oh , et al. May 10, 2
2016-05-10
Changing settings for a transient period associated with a deterministic event
Grant 9,304,568 - Chang , et al. April 5, 2
2016-04-05
Nonvolatile memory with chip-select/device-address triggered on-die termination
Grant 9,306,565 - Oh , et al. April 5, 2
2016-04-05
Memory device with programmed device address and on-die-termination
Grant 9,306,567 - Oh , et al. April 5, 2
2016-04-05
Nonvolatile memory device with on-die control and data signal termination
Grant 9,306,564 - Oh , et al. April 5, 2
2016-04-05
Nonvolatile memory with command-driven on-die termination
Grant 9,306,566 - Oh , et al. April 5, 2
2016-04-05
Controlling on-die termination in a nonvolatile memory
Grant 9,306,568 - Oh , et al. April 5, 2
2016-04-05
On-die termination of address and command signals
Grant 9,299,407 - Shaeffer , et al. March 29, 2
2016-03-29
Controlling a Flash Device Having Time-Multiplexed, On-Die-Terminated Signaling Interface
App 20160005489 - Oh; Kyung Suk ;   et al.
2016-01-07
Techniques relating to phase-locked loop circuits
Grant 9,231,601 - Oh , et al. January 5, 2
2016-01-05
Nonvolatile memory device with time-multiplexed, on-die-terminated signaling interface
Grant 9,225,328 - Oh , et al. December 29, 2
2015-12-29
Memory Device Comprising Programmable Command-and-address And/or Data Interfaces
App 20150332746 - Shaeffer; Ian ;   et al.
2015-11-19
Receiver with clock recovery circuit and adaptive sample and equalizer timing
Grant 9,178,688 - Lin , et al. November 3, 2
2015-11-03
Structure For Delivering Power
App 20150305141 - Oh; Kyung Suk ;   et al.
2015-10-22
Buffered memory module having multi-valued on-die termination
Grant 9,166,583 - Oh , et al. October 20, 2
2015-10-20
Integrated circuit system with dynamic decoupling and method of manufacture thereof
Grant 9,153,572 - Oh , et al. October 6, 2
2015-10-06
Controlling On-die Termination In A Nonvolatile Memory
App 20150263733 - Oh; Kyung Suk ;   et al.
2015-09-17
Command-triggered on-die termination
Grant 9,135,206 - Oh , et al. September 15, 2
2015-09-15
Memory Device With Programmed Device Address And On-die-termination
App 20150249451 - Oh; Kyung Suk ;   et al.
2015-09-03
Nonvolatile Memory With Command-driven On-die Termination
App 20150244365 - Oh; Kyung Suk ;   et al.
2015-08-27
Nonvolatile Memory With Chip-select/device-address Triggered On-die Termination
App 20150244364 - Oh; Kyung Suk ;   et al.
2015-08-27
Memory device comprising programmable command-and-address and/or data interfaces
Grant 9,117,496 - Shaeffer , et al. August 25, 2
2015-08-25
Nonvolatile Memory Device With Time-multiplexed, On-die-terminated Signaling Interface
App 20150236694 - Oh; Kyung Suk ;   et al.
2015-08-20
Nonvolatile Memory Device With On-die Control And Data Signal Termination
App 20150229306 - Oh; Kyung Suk ;   et al.
2015-08-13
Reducing Unwanted Reflections in Source-Terminated Channels
App 20150205751 - Oh; Kyung Suk ;   et al.
2015-07-23
On-Die Termination of Address and Command Signals
App 20150170724 - Shaeffer; Ian ;   et al.
2015-06-18
Methods and systems for reducing supply and termination noise
Grant 9,059,695 - Oh June 16, 2
2015-06-16
Command-triggered On-die Termination
App 20150084672 - Oh; Kyung Suk ;   et al.
2015-03-26
Multi-valued on-die termination
Grant 8,981,811 - Oh , et al. March 17, 2
2015-03-17
Buffered Memory Module Having Multi-valued On-die Termination
App 20150042378 - Oh; Kyung Suk ;   et al.
2015-02-12
On-die termination of address and command signals
Grant 8,947,962 - Shaeffer , et al. February 3, 2
2015-02-03
Power saving driver design
Grant 8,922,245 - Oh , et al. December 30, 2
2014-12-30
Power saving driver design
Grant 08922245 -
2014-12-30
Integrated Circuits With On-Die Decoupling Capacitors
App 20140374877 - Oh; Kyung Suk ;   et al.
2014-12-25
Simultaneous switching noise cancellation by adjusting reference voltage and sampling clock phase
Grant 8,878,592 - Oh November 4, 2
2014-11-04
Methods and Systems for Reducing Supply and Termination Noise
App 20140285232 - Oh; Kyung Suk
2014-09-25
Systems and methods for reducing power supply noise or jitter
Grant 8,836,384 - Oh , et al. September 16, 2
2014-09-16
Changing Settings For A Transient Period Associated With A Deterministic Event
App 20140258768 - Chang; Yu ;   et al.
2014-09-11
Receiver with Clock Recovery Circuit and Adaptive Sample and Equalizer Timing
App 20140169438 - Lin; Qi ;   et al.
2014-06-19
On-Die Termination of Address and Command Signals
App 20140112084 - Shaeffer; Ian ;   et al.
2014-04-24
Signal lines with internal and external termination
Grant 8,692,573 - Oh , et al. April 8, 2
2014-04-08
Methods and systems for reducing supply and termination noise
Grant 8,692,574 - Oh April 8, 2
2014-04-08
Power Saving Driver Design
App 20140043069 - Oh; Kyung Suk ;   et al.
2014-02-13
Timing Calibration For Multimode I/o Systems
App 20140019792 - Oh; Kyung Suk ;   et al.
2014-01-16
Dynamic on-die termination selection
Grant 8,610,455 - Oh , et al. December 17, 2
2013-12-17
Controlling on-die termination in a dynamic random access memory device
Grant 8,610,459 - Oh , et al. December 17, 2
2013-12-17
Simultaneous Switching Noise Cancellation By Adjusting Reference Voltage And Sampling Clock Phase
App 20130307607 - Oh; Kyung Suk
2013-11-21
Multi-valued On-die Termination
App 20130307584 - Oh; Kyung Suk ;   et al.
2013-11-21
Asymmetric communication on shared links
Grant 8,588,280 - Oh , et al. November 19, 2
2013-11-19
Balanced on-die termination
Grant 8,588,012 - Wilson , et al. November 19, 2
2013-11-19
Receiver with clock recovery circuit and adaptive sample and equalizer timing
Grant 8,548,110 - Lin , et al. October 1, 2
2013-10-01
Memory Device Comprising Programmable Command-and-address And/or Data Interfaces
App 20130194854 - Shaeffer; Ian ;   et al.
2013-08-01
Frequency responsive bus coding
Grant 8,451,913 - Oh , et al. May 28, 2
2013-05-28
Integrated Circuit Device Timing Calibration
App 20130076425 - Oh; Kyung Suk ;   et al.
2013-03-28
Controlling On-die Termination In A Dynamic Random Access Memory Device
App 20120265930 - Oh; Kyung Suk ;   et al.
2012-10-18
Methods and Systems for Reducing Supply and Termination Noise
App 20120182044 - Oh; Kyung Suk
2012-07-19
Controlling dynamic selection of on-die termination
Grant 8,188,762 - Oh , et al. May 29, 2
2012-05-29
Signal Lines With Internal And External Termination
App 20120081146 - Oh; Kyung Suk ;   et al.
2012-04-05
Signal lines with internal and external termination
Grant 8,130,010 - Oh , et al. March 6, 2
2012-03-06
Integrated circuit device with dynamically selected on-die termination
Grant 8,089,298 - Oh , et al. January 3, 2
2012-01-03
Balanced On-die Termination
App 20110314200 - Wilson; John ;   et al.
2011-12-22
Controlling Dynamic Selection Of On-die Termination
App 20110267101 - Oh; Kyung Suk ;   et al.
2011-11-03
Dynamic On-die Termination Selection
App 20110241727 - Oh; Kyung Suk ;   et al.
2011-10-06
Integrated Circuit Device With Dynamically Selected On-die Termination
App 20110156750 - Oh; Kyung Suk ;   et al.
2011-06-30
Signal Lines With Internal And External Termination
App 20110128040 - Oh; Kyung Suk ;   et al.
2011-06-02
Detachable Interconnect For Configurable Width Memory System
App 20110119425 - Kollipara; Ravindranath ;   et al.
2011-05-19
Frequency Responsive Bus Coding
App 20110084737 - Oh; Kyung Suk ;   et al.
2011-04-14
Memory controller that controls termination in a memory device
Grant 7,924,048 - Oh , et al. April 12, 2
2011-04-12
Signal lines with internal and external termination
Grant 7,915,912 - Oh , et al. March 29, 2
2011-03-29
Memory Controller That Controls Termination In A Memory Device
App 20100315122 - Oh; Kyung Suk ;   et al.
2010-12-16
Asymmetric Communication On Shared Links
App 20100309964 - Oh; Kyung Suk ;   et al.
2010-12-09
Memory-module buffer with on-die termination
Grant 7,782,082 - Oh , et al. August 24, 2
2010-08-24
Signal Lines With Internal And External Termination
App 20100073023 - Oh; Kyung Suk ;   et al.
2010-03-25
Memory-module Buffer With On-die Termination
App 20090284281 - Oh; Kyung Suk ;   et al.
2009-11-19
Controlling memory devices that have on-die termination
Grant 7,602,209 - Oh , et al. October 13, 2
2009-10-13
Integrated circuit with graduated on-die termination
Grant 7,486,104 - Oh , et al. February 3, 2
2009-02-03
Controlling Memory Devices That Have On-die Termination
App 20080315916 - Oh; Kyung Suk ;   et al.
2008-12-25
Integrated Circuit With Graduated On-die Termination
App 20070279084 - Oh; Kyung Suk ;   et al.
2007-12-06
Circuits, systems and methods for dynamic reference voltage calibration
Grant 7,236,894 - Oh , et al. June 26, 2
2007-06-26
Circuits, systems and methods for dynamic reference voltage calibration
Grant 7,162,376 - Oh , et al. January 9, 2
2007-01-09
Circuits, systems and methods for dynamic reference voltage calibration
App 20060142959 - Oh; Kyung Suk ;   et al.
2006-06-29
Circuits, systems and methods for dynamic reference voltage calibration
App 20060142977 - Oh; Kyung Suk ;   et al.
2006-06-29

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