Oh; Kook-jin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oh; Kook-jin.The latest application filed is for "led package and method of manufacturing the same".

Company Profile

0.5.9

Oh; Kook-jin - Asan-si N/A KR
Oh; Kook-jin - Ansan-si KR
Oh; Kook Jin - Chungcheongnam-do KR
Oh; Kook-Jin - Cheonan-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light-emitting device package and method of manufacturing the same Grant 8,829,691 - Lim , et al. September 9, 2	2014-09-09
Led Package And Method Of Manufacturing The Same App 20130248905 - LEE; Ju-Kyung ; et al.	2013-09-26
Method Of Manufacturing Light Emitting Device And Phosphor-containing Fluid Resin Dispensing Apparatus App 20130177998 - Hong; Jee Hun ; et al.	2013-07-11
Light-emitting Device Package And Method Of Manufacturing The Same App 20120175665 - LIM; Jae-yun ; et al.	2012-07-12
Apparatus for transferring semiconductor chip Grant 7,793,408 - Oh September 14, 2	2010-09-14
System and method for automated wire bonding Grant 7,631,795 - Kim , et al. December 15, 2	2009-12-15
Wire bonding apparatus and method for clamping a wire Grant 7,481,351 - Kim , et al. January 27, 2	2009-01-27
Apparatus For Transferring Semiconductor Chip And Method Of Transferring Semiconductor Chip Using The Same App 20080148558 - OH; Kook-Jin	2008-06-26
Apparatus and method for wire bonding and die attaching App 20050269713 - Oh, Kook-Jin ; et al.	2005-12-08
System and method for automated wire bonding App 20050173491 - Kim, Byung-Soo ; et al.	2005-08-11
Wire bonding apparatus and method for clamping a wire App 20050133563 - Kim, Tae-Hyun ; et al.	2005-06-23
Snap cure device for semiconductor chip attachment App 20050126696 - Oh, Kook-Jin ; et al.	2005-06-16

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