| Patent | Date |
|---|
Graphite sheet and method for manufacturing same
Grant 11,040,516 - Park , et al. June 22, 2 | 2021-06-22 |
Composition for semiconductor process and semiconductor process
Grant 10,968,390 - Kim , et al. April 6, 2 | 2021-04-06 |
Graphite Sheet And Method For Manufacturing Same
App 20200223700 - PARK; Ki Ryun ; et al. | 2020-07-16 |
Boron Carbide Sintered Body And Etcher Including The Same
App 20200062654 - HWANG; Sung Sic ; et al. | 2020-02-27 |
Ring-shaped Element For Etcher And Method For Etching Substrate Using The Same
App 20200051793 - HWANG; Sung Sic ; et al. | 2020-02-13 |
Composition For Semiconductor Process And Semiconductor Process
App 20190276778 - KIM; Byoungsoo ; et al. | 2019-09-12 |
Composition For Semiconductor Process And Semiconductor Process
App 20190276740 - KIM; Byoungsoo ; et al. | 2019-09-12 |
Graphite Sheet And Method For Manufacturing Same
App 20180265362 - PARK; Ki Ryun ; et al. | 2018-09-20 |
Poly(p-xylylene)-based polymer having low dielectric constant and low-loss property and insulating material, printed circuit board and functional element using the same
Grant 8,829,155 - Cho , et al. September 9, 2 | 2014-09-09 |
Composition for forming substrate, and prepreg and substrate using the same
Grant 8,105,663 - Lee , et al. January 31, 2 | 2012-01-31 |
Composition for forming substrate, and prepreg and substrate using the same
Grant 8,101,248 - Yun , et al. January 24, 2 | 2012-01-24 |
Capacitor embedded printed circuit board
Grant 8,053,673 - Kim , et al. November 8, 2 | 2011-11-08 |
Light emitting diode package and manufacturing method thereof
Grant 8,043,876 - Lee , et al. October 25, 2 | 2011-10-25 |
Composition For Forming Substrate, And Prepreg And Substrate Using The Same
App 20110172357 - LEE; Keun Yong ; et al. | 2011-07-14 |
Composition For Forming Substrate, And Prepreg And Substrate Using The Same
App 20110121233 - Yun; Geum Hee ; et al. | 2011-05-26 |
Method of manufacturing chip capacitor including ceramic/polymer composite
Grant 7,913,368 - Kim , et al. March 29, 2 | 2011-03-29 |
Composition For Forming Substrate, and Prepreg and Substrate Using The Same
App 20100283004 - LEE; Keun Yong ; et al. | 2010-11-11 |
Resin Composition For Printed Circuit Board and Printed Circuit Board Using The Same
App 20100270065 - Cho; Jae Choon ; et al. | 2010-10-28 |
Resin Composition For Printed Circuit Board And Printed Circuit Board Using The Same
App 20100270064 - Cho; Jae Choon ; et al. | 2010-10-28 |
Heat Radiation Substrate and Illumination Module Substrate Having Hybrid Layer
App 20100255742 - YUN; Geum Hee ; et al. | 2010-10-07 |
Norbornene-based Polymer Having Low Dielectric Constant And Low-loss Properties And Insulating Material Using The Same
App 20100210803 - CHO; Jae-Choon ; et al. | 2010-08-19 |
Method Of Manufacturing Chip Capacitor Including Ceramic/polymer Composite
App 20100077582 - Kim; Jin Cheol ; et al. | 2010-04-01 |
Method of manufacturing printed circuit board including embedded capacitors
Grant 7,676,921 - Kim , et al. March 16, 2 | 2010-03-16 |
Norbornene-based Polymer Having Low Dielectric Constant And Low-loss Properties, And Insulating Material, Printed Circuit Board And Function Element Using The Same
App 20100063226 - Cho; Jae-Choon ; et al. | 2010-03-11 |
Poly(p-xylylene)-based Polymer Having Low Dielectric Constant And Low-loss Property And Insulating Material, Printed Circuit Board And Functional Element Using The Same
App 20100048858 - CHO; Jae-Choon ; et al. | 2010-02-25 |
Glass Composition With Low Coefficient Of Thermal Expansion, Glass Fiber, Insulating Layer Of Printed Circuit Board And Printed Circuit Board
App 20090288863 - Kim; Jin-Cheol ; et al. | 2009-11-26 |
Insulating material for printed circuit board
Grant 7,618,553 - Kim , et al. November 17, 2 | 2009-11-17 |
Backlight unit using a thermoplastic resin board
App 20090262520 - Park; Ho-Joon ; et al. | 2009-10-22 |
Light emitting diode package and manufacturing method thereof
App 20090189177 - Lee; Hwa-Young ; et al. | 2009-07-30 |
Light emitting diode unit
App 20090168449 - Park; Ho-Joon ; et al. | 2009-07-02 |
Array light source using led and backlight unit including the same
App 20090141481 - PARK; Ho-Joon ; et al. | 2009-06-04 |
Probe card using thermoplastic resin
App 20090128174 - Park; Ho-Joon ; et al. | 2009-05-21 |
Manufacturing method of printed circuit board
App 20090106977 - Kim; Jin-Cheol ; et al. | 2009-04-30 |
Flame Retardant Resin Composition For Printed Circuit Board, Printed Circuit Board Using The Same And Manufacturing Method Thereof
App 20090072207 - CHO; Jae-Choon ; et al. | 2009-03-19 |
Eucryptite ceramic filler and insulating composite material containing the same
App 20080242787 - Kim; Jin-Cheol ; et al. | 2008-10-02 |
Capacitor embedded printed circuit board
App 20080223603 - Kim; Jin Cheol ; et al. | 2008-09-18 |
Insulating material for printed circuit board
App 20080081177 - Kim; Jin Cheol ; et al. | 2008-04-03 |
Printed Circuit Board Including Embedded Capacitors And Method Of Manufacturing The Same
App 20070240303 - Kim; Jin Cheol ; et al. | 2007-10-18 |
Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same
Grant 7,281,321 - Kim , et al. October 16, 2 | 2007-10-16 |
Printed Circuit Board Having Embedded Capacitors Using Hybrid Material And Method Of Manufacturing The Same
App 20070125574 - Kim; Tae Kyoung ; et al. | 2007-06-07 |
Printed circuit board including embedded capacitors and method of manufacturing the same
Grant 7,186,919 - Kim , et al. March 6, 2 | 2007-03-06 |
Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same
App 20060243479 - Kim; Tae Kyoung ; et al. | 2006-11-02 |
Printed circuit board including embedded capacitors and method of manufacturing the same
App 20060032666 - Kim; Jin Cheol ; et al. | 2006-02-16 |
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