Oh; Jae Sung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oh; Jae Sung.The latest application filed is for "stacked semiconductor package and method for manufacturing the same".

Company Profile

0.6.7

Oh; Jae Sung - Gyeonggi-do KR
Oh; Jae Sung - Icheon-si KR
OH; Jae Sung - Icheon-si Gyeonggi-do KR
Oh; Jae Sung - Kyoungki-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package and stacked semiconductor package having the same Grant 9,070,691 - Oh , et al. June 30, 2	2015-06-30
Stacked semiconductor package and method for manufacturing the same Grant 9,030,009 - Moon , et al. May 12, 2	2015-05-12
Stacked Semiconductor Package And Method For Manufacturing The Same App 20140361426 - MOON; Ki Il ; et al.	2014-12-11
Semiconductor Package And Stacked Semiconductor Package Having The Same App 20140332946 - OH; Jae Sung ; et al.	2014-11-13
Semiconductor package and stacked semiconductor package having the same Grant 8,823,158 - Oh , et al. September 2, 2	2014-09-02
Semiconductor Chip Module And Semiconductor Package Having The Same App 20140014958 - OH; Tac Keun ; et al.	2014-01-16
Semiconductor Package And Stacked Semiconductor Package Having The Same App 20130026651 - OH; Jae Sung ; et al.	2013-01-31
Semiconductor package and stacked semiconductor package having the same Grant 8,299,591 - Oh , et al. October 30, 2	2012-10-30
Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same Grant 8,024,857 - Jung , et al. September 27, 2	2011-09-27
High capacity memory module using flexible substrate Grant 7,732,903 - Oh June 8, 2	2010-06-08
Substrate For Semiconductor Package Having A Reinforcing Member That Prevents Distortions And Method For Fabricating The Same App 20100117200 - JUNG; Young Hy ; et al.	2010-05-13
Semiconductor Package And Stacked Semiconductor Package Having The Same App 20100072598 - OH; Jae Sung ; et al.	2010-03-25
High Capacity Memory Module Using Flexible Substrate App 20080157317 - OH; Jae Sung	2008-07-03

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