loadpatents
name:-0.01586389541626
name:-0.004539966583252
name:-0.0037610530853271
OH; Hyun Ji Patent Filings

OH; Hyun Ji

Patent Applications and Registrations

Patent applications and USPTO patent grants for OH; Hyun Ji.The latest application filed is for "thermoplastic resin composition and molded article formed therefrom".

Company Profile
4.5.13
  • OH; Hyun Ji - Uiwang-si KR
  • OH; Hyun Ji - Cheonan-si Chungcheongnam-do
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Thermoplastic Resin Composition and Molded Article Formed Therefrom
App 20220259421 - LEE; Jin Seong ;   et al.
2022-08-18
Compound For Organic Electric Device, Organic Electric Device Using The Same, And Electronic Device Thereof
App 20220251063 - LEE; Je Woo ;   et al.
2022-08-11
Compound For Organic Electronic Element, Organic Electronic Element Using The Same, And An Electronic Device Thereof
App 20220093869 - KIM; Won Sam ;   et al.
2022-03-24
Thermoplastic Resin Composition and Molded Article Produced Therefrom
App 20220049084 - JEONG; Hyun Taek ;   et al.
2022-02-17
Thermoplastic Resin Composition and Molded Article Therefrom
App 20210388140 - LEE; Jin Seong ;   et al.
2021-12-16
Compound For Organic Electric Element, Organic Electric Element Using Same, And Electronic Device Thereof
App 20210380568 - KIM; Yu Ri ;   et al.
2021-12-09
Compound For An Organic Electric Element, An Organic Electric Element Using The Same, And An Electronic Device Thereof
App 20210320258 - OH; Hyun Ji ;   et al.
2021-10-14
Thermoplastic resin composition and article produced therefrom
Grant 11,091,621 - Lee , et al. August 17, 2
2021-08-17
Thermoplastic resin composition and article produced therefrom
Grant 11,091,624 - Ham , et al. August 17, 2
2021-08-17
Compound for organic electronic element, organic electronic element using the same, and an electronic device thereof
Grant 11,072,603 - Kim , et al. July 27, 2
2021-07-27
Compound for organic electronic element, organic electronic element using the same, and an electronic device thereof
Grant 11,072,604 - Kim , et al. July 27, 2
2021-07-27
Compound For Organic Electronic Element, Organic Electronic Element Using The Same, And An Electronic Device Thereof
App 20210147396 - KIM; Won Sam ;   et al.
2021-05-20
Compound For Organic Electronic Element, Organic Electronic Element Using The Same, And An Electronic Device Thereof
App 20210147397 - Kim; Won Sam ;   et al.
2021-05-20
Compound For Organic Electric Element, Organic Electric Element Comprising The Same, And Electronic Device Thereof
App 20200321530 - LEE; Se Hoon ;   et al.
2020-10-08
Thermoplastic Resin Composition and Article Produced Therefrom
App 20190359812 - LEE; Jin Seong ;   et al.
2019-11-28
Thermoplastic Resin Composition and Article Produced Therefrom
App 20190249001 - HAM; Min Kyoung ;   et al.
2019-08-15
Thermoplastic resin composition and molded article produced therefrom
Grant 10,377,892 - Oh A
2019-08-13
Thermoplastic Resin Composition and Molded Article Produced Therefrom
App 20180186994 - OH; Hyun Ji
2018-07-05

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