Oh; Hwa Sub
Patent Applications and Registrations
Patent applications and USPTO patent grants for Oh; Hwa Sub.The latest application filed is for "fan-out semiconductor package".
- Oh; Hwa Sub - Suwon-si KR
- Oh; Hwa Sub - Suwon KR
- Oh; Hwa-Sub - Gyunggi-do N/A KR
- OH; Hwa-Sub - Seo-gu KR
| Patent | Date |
|---|---|
| Fan-out semiconductor package Grant 10,643,919 - Oh , et al. | 2020-05-05 |
| Fan-out Semiconductor Package App 20190139853 - OH; Hwa Sub ; et al. | 2019-05-09 |
| Printed Circuit Board And Method For Manufacturing The Same App 20140174793 - Oh; Chang Gun ; et al. | 2014-06-26 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20130333927 - Cho; Hyun Chul ; et al. | 2013-12-19 |
| Method of manufacturing printed circuit board Grant 8,399,801 - Oh , et al. March 19, 2 | 2013-03-19 |
| Method Of Manufacturing Printed Circuit Board App 20100258545 - OH; Hwa-Sub ; et al. | 2010-10-14 |
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