loadpatents
Patent applications and USPTO patent grants for Oh; Dong Sub.The latest application filed is for "substrate treating apparatus and substrate treating system comprising the same".
Patent | Date |
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Substrate Treating Apparatus And Substrate Treating System Comprising The Same App 20220090861 - Um; Young Je ;   et al. | 2022-03-24 |
Method For Fabricating Semiconductor Device And Apparatus For Processing Substrate Using Plasma App 20220084829 - Koo; Joun Taek ;   et al. | 2022-03-17 |
Apparatus And Method For Processing Substrate Using Plasma App 20220076925 - Koo; Joun Yaek ;   et al. | 2022-03-10 |
Liquid dispensing nozzle and substrate treating apparatus Grant 11,148,150 - Choi , et al. October 19, 2 | 2021-10-19 |
Apparatus For Treating Substrate And Method For Treating Substrate App 20210287877 - KIM; DONG-HUN ;   et al. | 2021-09-16 |
Method For Treating Substrate And Apparatus For Treating Substrate App 20210151333 - LEE; JI-HWAN ;   et al. | 2021-05-20 |
Apparatus And Method For Processing Substrate App 20210013049 - Lee; Seong Gil ;   et al. | 2021-01-14 |
Liquid Dispensing Nozzle And Substrate Treating Apparatus App 20200122165 - CHOI; BYOUNGDOO ;   et al. | 2020-04-23 |
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