Oh; Chee-Way
Patent Applications and Registrations
Patent applications and USPTO patent grants for Oh; Chee-Way.The latest application filed is for "high frequency flip chip package structure of polymer substrate".
- Oh; Chee-Way - Hsinchu TW
| Patent | Date |
|---|---|
| High frequency flip chip package structure of polymer substrate Grant 8,258,606 - Chang , et al. September 4, 2 | 2012-09-04 |
| High frequency flip chip package process of polymer substrate and structure thereof Grant 8,033,039 - Chang , et al. October 11, 2 | 2011-10-11 |
| High Frequency Flip Chip Package Structure Of Polymer Substrate App 20110186974 - Chang; Edward-yi ; et al. | 2011-08-04 |
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