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Method for separating sapphire wafer into chips using dry-etching Grant 7,151,045 - Kim , et al. December 19, 2 | 2006-12-19 |
Light emitting diode and method for manufacturing the same Grant 7,119,375 - Baik , et al. October 10, 2 | 2006-10-10 |
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Nitride semiconductor LED improved in lighting efficiency and fabrication method thereof Grant 7,078,256 - Ryu , et al. July 18, 2 | 2006-07-18 |
Method for separating sapphire wafer into chips Grant 7,074,652 - Yoon , et al. July 11, 2 | 2006-07-11 |
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Method for separating sapphire wafer into chips App 20050079687 - Yoon, Jeong Goo ;   et al. | 2005-04-14 |
Nitride semiconductor light emitting device and method of manufacturing the same App 20050077536 - Choi, Seok Beom ;   et al. | 2005-04-14 |
Method for separating sapphire wafer into chips using dry-etching App 20050064615 - Kim, Ju Hyun ;   et al. | 2005-03-24 |
Method for cutting semiconductor wafer using laser scribing process App 20040198024 - Yoon, Jeong Goo ;   et al. | 2004-10-07 |
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Light emitting diode and method for manufacturing the same App 20040108511 - Baik, Doo Go ;   et al. | 2004-06-10 |
Submount integrated photodiode and laser diode package using the same Grant 6,703,677 - Lee , et al. March 9, 2 | 2004-03-09 |
Submount Integrated Photodiode And Laser Diode Package Using The Same App 20030232485 - Lee, Kyung Ho ;   et al. | 2003-12-18 |
Chip package and method of manufacturing the same App 20030122231 - Ahn, Moon Bong ;   et al. | 2003-07-03 |
Chip type thin film capacitor, and manufacturing method therefor Grant 6,236,102 - Kim , et al. May 22, 2 | 2001-05-22 |