loadpatents
Patent applications and USPTO patent grants for Ogure; Naoaki.The latest application filed is for "submerged electrode and material thereof".
Patent | Date |
---|---|
Composite nanoparticles method for producing the same Grant 7,799,425 - Chikamori , et al. September 21, 2 | 2010-09-21 |
Submerged Electrode and Material Thereof App 20080271911 - Ogure; Naoaki ;   et al. | 2008-11-06 |
Substrate plating method and apparatus App 20060144714 - Hongo; Akihisa ;   et al. | 2006-07-06 |
Bonding apparatus and bonding method App 20060118598 - Chikamori; Yusuke ;   et al. | 2006-06-08 |
Substrate plating method and apparatus Grant 7,033,463 - Hongo , et al. April 25, 2 | 2006-04-25 |
Joining method and apparatus App 20060076387 - Ogure; Naoaki ;   et al. | 2006-04-13 |
Method and apparatus for forming thin film of metal Grant 6,972,256 - Fukunaga , et al. December 6, 2 | 2005-12-06 |
Reactive detection chip and spotter suitable for manufacturing the chip App 20050254998 - Nakamura, Kenro ;   et al. | 2005-11-17 |
Substrate plating apparatus Grant 6,929,722 - Hongo , et al. August 16, 2 | 2005-08-16 |
Coating, modification and etching of substrate surface with particle beam irradiation of the same Grant 6,921,722 - Ogure , et al. July 26, 2 | 2005-07-26 |
Bonding material and bonding method App 20040245648 - Nagasawa, Hiroshi ;   et al. | 2004-12-09 |
Substrate plating apparatus and method Grant 6,793,794 - Hongo , et al. September 21, 2 | 2004-09-21 |
Method of forming embedded copper interconnections and embedded copper interconnection structure Grant 6,787,467 - Ogure , et al. September 7, 2 | 2004-09-07 |
Substrate plating apparatus App 20040163947 - Hongo, Akihisa ;   et al. | 2004-08-26 |
Method of and apparatus for forming interconnection Grant 6,730,596 - Fukunaga , et al. May 4, 2 | 2004-05-04 |
Plating method, interconnection forming method, and apparatus for carrying out those methods Grant 6,709,555 - Ogure , et al. March 23, 2 | 2004-03-23 |
Substrate coated with a conductive layer and manufacturing method thereof Grant 6,651,871 - Ogure November 25, 2 | 2003-11-25 |
Method and apparatus for plating substrate and plating facility Grant 6,558,518 - Sendai , et al. May 6, 2 | 2003-05-06 |
Substrate coated with a conductive layer and manufacturing method thereof App 20030059541 - Ogure, Naoaki | 2003-03-27 |
Method and apparatus for forming thin film of metal App 20020160103 - Fukunaga, Akira ;   et al. | 2002-10-31 |
Substrate plating apparatus App 20020139683 - Hongo, Akihisa ;   et al. | 2002-10-03 |
Method of forming embedded copper interconnections and embedded copper interconnection structure App 20020111022 - Ogure, Naoaki ;   et al. | 2002-08-15 |
Apparatus and method for processing substrate Grant 6,387,182 - Horie , et al. May 14, 2 | 2002-05-14 |
Method and apparatus for forming interconnect App 20020009883 - Ogure, Naoaki ;   et al. | 2002-01-24 |
Substrate plating apparatus App 20020005359 - Hongo, Akihisa ;   et al. | 2002-01-17 |
Coating, modification and etching of substrate surface with particle beam irradiation of the same App 20010055649 - Ogure, Naoaki ;   et al. | 2001-12-27 |
Substrate plating apparatus Grant 6,294,059 - Hongo , et al. September 25, 2 | 2001-09-25 |
Method of forming embedded copper interconnections and embedded copper interconnection structure Grant 6,147,408 - Ogure , et al. November 14, 2 | 2000-11-14 |
Liquid material vaporizer apparatus and gas ejection device Grant 6,036,783 - Fukunaga , et al. March 14, 2 | 2000-03-14 |
Device containing solar cell panel and storage battery Grant 6,005,183 - Akai , et al. December 21, 1 | 1999-12-21 |
Vaporizer apparatus Grant 5,862,605 - Horie , et al. January 26, 1 | 1999-01-26 |
Spin dryer apparatus Grant 5,829,156 - Shibasaki , et al. November 3, 1 | 1998-11-03 |
Method for filling small holes or covering small recesses in the surface of substrates Grant 5,705,230 - Matanabe , et al. January 6, 1 | 1998-01-06 |
Method for manufacturing wiring in groove Grant 5,656,542 - Miyata , et al. August 12, 1 | 1997-08-12 |
Thin-film forming apparatus with magnetic bearings and a non-contact seal and drive Grant 5,630,881 - Ogure , et al. May 20, 1 | 1997-05-20 |
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