Ogure; Naoaki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ogure; Naoaki.The latest application filed is for "submerged electrode and material thereof".
- Ogure; Naoaki - Tokyo JP
- Ogure; Naoaki - Ohta-ku JP
- Ogure, Naoaki - Nakano-ku JP
| Patent | Date |
|---|---|
| Composite nanoparticles method for producing the same Grant 7,799,425 - Chikamori , et al. September 21, 2 | 2010-09-21 |
| Submerged Electrode and Material Thereof App 20080271911 - Ogure; Naoaki ; et al. | 2008-11-06 |
| Substrate plating method and apparatus App 20060144714 - Hongo; Akihisa ; et al. | 2006-07-06 |
| Bonding apparatus and bonding method App 20060118598 - Chikamori; Yusuke ; et al. | 2006-06-08 |
| Substrate plating method and apparatus Grant 7,033,463 - Hongo , et al. April 25, 2 | 2006-04-25 |
| Joining method and apparatus App 20060076387 - Ogure; Naoaki ; et al. | 2006-04-13 |
| Method and apparatus for forming thin film of metal Grant 6,972,256 - Fukunaga , et al. December 6, 2 | 2005-12-06 |
| Reactive detection chip and spotter suitable for manufacturing the chip App 20050254998 - Nakamura, Kenro ; et al. | 2005-11-17 |
| Substrate plating apparatus Grant 6,929,722 - Hongo , et al. August 16, 2 | 2005-08-16 |
| Coating, modification and etching of substrate surface with particle beam irradiation of the same Grant 6,921,722 - Ogure , et al. July 26, 2 | 2005-07-26 |
| Bonding material and bonding method App 20040245648 - Nagasawa, Hiroshi ; et al. | 2004-12-09 |
| Substrate plating apparatus and method Grant 6,793,794 - Hongo , et al. September 21, 2 | 2004-09-21 |
| Method of forming embedded copper interconnections and embedded copper interconnection structure Grant 6,787,467 - Ogure , et al. September 7, 2 | 2004-09-07 |
| Substrate plating apparatus App 20040163947 - Hongo, Akihisa ; et al. | 2004-08-26 |
| Method of and apparatus for forming interconnection Grant 6,730,596 - Fukunaga , et al. May 4, 2 | 2004-05-04 |
| Plating method, interconnection forming method, and apparatus for carrying out those methods Grant 6,709,555 - Ogure , et al. March 23, 2 | 2004-03-23 |
| Substrate coated with a conductive layer and manufacturing method thereof Grant 6,651,871 - Ogure November 25, 2 | 2003-11-25 |
| Method and apparatus for plating substrate and plating facility Grant 6,558,518 - Sendai , et al. May 6, 2 | 2003-05-06 |
| Substrate coated with a conductive layer and manufacturing method thereof App 20030059541 - Ogure, Naoaki | 2003-03-27 |
| Method and apparatus for forming thin film of metal App 20020160103 - Fukunaga, Akira ; et al. | 2002-10-31 |
| Substrate plating apparatus App 20020139683 - Hongo, Akihisa ; et al. | 2002-10-03 |
| Method of forming embedded copper interconnections and embedded copper interconnection structure App 20020111022 - Ogure, Naoaki ; et al. | 2002-08-15 |
| Apparatus and method for processing substrate Grant 6,387,182 - Horie , et al. May 14, 2 | 2002-05-14 |
| Method and apparatus for forming interconnect App 20020009883 - Ogure, Naoaki ; et al. | 2002-01-24 |
| Substrate plating apparatus App 20020005359 - Hongo, Akihisa ; et al. | 2002-01-17 |
| Coating, modification and etching of substrate surface with particle beam irradiation of the same App 20010055649 - Ogure, Naoaki ; et al. | 2001-12-27 |
| Substrate plating apparatus Grant 6,294,059 - Hongo , et al. September 25, 2 | 2001-09-25 |
| Method of forming embedded copper interconnections and embedded copper interconnection structure Grant 6,147,408 - Ogure , et al. November 14, 2 | 2000-11-14 |
| Liquid material vaporizer apparatus and gas ejection device Grant 6,036,783 - Fukunaga , et al. March 14, 2 | 2000-03-14 |
| Device containing solar cell panel and storage battery Grant 6,005,183 - Akai , et al. December 21, 1 | 1999-12-21 |
| Vaporizer apparatus Grant 5,862,605 - Horie , et al. January 26, 1 | 1999-01-26 |
| Spin dryer apparatus Grant 5,829,156 - Shibasaki , et al. November 3, 1 | 1998-11-03 |
| Method for filling small holes or covering small recesses in the surface of substrates Grant 5,705,230 - Matanabe , et al. January 6, 1 | 1998-01-06 |
| Method for manufacturing wiring in groove Grant 5,656,542 - Miyata , et al. August 12, 1 | 1997-08-12 |
| Thin-film forming apparatus with magnetic bearings and a non-contact seal and drive Grant 5,630,881 - Ogure , et al. May 20, 1 | 1997-05-20 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 