Ogiwara; Yoshiaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ogiwara; Yoshiaki.The latest application filed is for "aluminum alloy material, and braided shield wire, electroconductive member, member for cell, fastening component, component for spring, component for structure, and cabtire cable using same".

Company Profile

0.6.12

Ogiwara; Yoshiaki - Tokyo JP
Ogiwara; Yoshiaki - Chiyoda-ku JP
Ogiwara; Yoshiaki - Nikko JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Movable cable Grant 11,410,787 - Araki , et al. August 9, 2	2022-08-09
Aluminum Alloy Material, And Braided Shield Wire, Electroconductive Member, Member For Cell, Fastening Component, Component For Spring, Component For Structure, And Cabtire Cable Using Same App 20210180161 - ARAKI; Akiyoshi ; et al.	2021-06-17
Plated Wire Rod App 20210164120 - YAMAUCHI; Miho ; et al.	2021-06-03
Movable Cable App 20210082596 - ARAKI; Akiyoshi ; et al.	2021-03-18
Aluminium Alloy Material, And Cable, Electric Wire, And Spring Member Using Same App 20210062303 - ARAKI; Akiyoshi ; et al.	2021-03-04
Plated Wire Rod Material, Method For Producing Same, And Cable, Electric Wire, Coil And Spring Member, Each Of Which Is Formed U App 20200024764 - YAMAUCHI; Miho ; et al.	2020-01-23
Metallic material for a connecting part and a method of producing the same Grant 8,101,285 - Mitose , et al. January 24, 2	2012-01-24
Micro-reactor And Method Of Manufacturing The Same App 20110041986 - KIHARA; Takeshi ; et al.	2011-02-24
Metallic Material For A Connecting Part And A Method Of Producing The Same App 20110020664 - MITOSE; Kengo ; et al.	2011-01-27
Micro-reactor and method of manufacturing the same Grant 7,857,874 - Kihara , et al. December 28, 2	2010-12-28
Conductive Base Material With Thin Film Resistance Layer, Method Of Production Of Conductive Base Material With Thin Film Resistance Layer, And Circuit Board With Thin Film Resistance Layer App 20070228443 - KIKUCHI; Yuuki ; et al.	2007-10-04
Aluminum alloy heat exchanger and method of producing the same Grant 7,247,392 - Sugano , et al. July 24, 2	2007-07-24
Micro-reactor and method of manufacturing the same App 20070163175 - Kihara; Takeshi ; et al.	2007-07-19
Aluminum alloy heat exchanger and method of producing the same App 20050153155 - Sugano, Kazumitsu ; et al.	2005-07-14
Aluminum alloy heat exchanger and method of producing the same App 20040009364 - Sugano, Kazumitsu ; et al.	2004-01-15
Aluminum alloy brazing sheet for a heat exchanger App 20020037426 - Yamada, Noriyuki ; et al.	2002-03-28
Plating method for a nickel-titanium alloy member Grant 5,464,524 - Ogiwara , et al. November 7, 1	1995-11-07
Method for producing rigid-type multilayer printed wiring board Grant 4,780,957 - Shiga , et al. November 1, 1	1988-11-01

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.