Ogiwara; Kesami
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ogiwara; Kesami.The latest application filed is for "method for precision shaping of wafer materials".
- Ogiwara; Kesami - Nagano JP
| Patent | Date |
|---|---|
| Method for precision shaping of wafer materials Grant 4,344,260 - Ogiwara August 17, 1 | 1982-08-17 |
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