| Patent | Date |
|---|
Semiconductor integrated circuit device and a method of manufacturing the same
Grant 7,397,104 - Suzuki , et al. July 8, 2 | 2008-07-08 |
Semiconductor device and manufacturing method thereof
App 20070075396 - Ogishima; Atsushi | 2007-04-05 |
Semiconductor integrated circuitry and method for manufacturing the circuitry
Grant 7,081,649 - Watanabe , et al. July 25, 2 | 2006-07-25 |
Semiconductor integrated circuit device and the process of manufacturing the same having poly-silicon plug, wiring trenches and bit lines formed in the wiring trenches having a width finer than a predetermined size
Grant 7,026,679 - Uchiyama , et al. April 11, 2 | 2006-04-11 |
Semiconductor memory device with less threshold variation
App 20050073000 - Oyu, Kiyonori ; et al. | 2005-04-07 |
Semiconductor integrated circuit device and the process of manufacturing the same for reducing the size of a memory cell by making the width of a bit line than a predetermined minimum size
Grant 6,867,092 - Uchiyama , et al. March 15, 2 | 2005-03-15 |
Semiconductor integrated circuitry and method for manufacturing the circuitry
App 20050017274 - Watanabe, Kozo ; et al. | 2005-01-27 |
Semiconductor memory device and method of manufacturing the same
App 20040209431 - Oyu, Kiyonori ; et al. | 2004-10-21 |
Semiconductor integrated circuitry and method for manufacturing the circuitry
Grant 6,800,888 - Watanabe , et al. October 5, 2 | 2004-10-05 |
Semiconductor integrated circuit device and a method of manufacturing the same
App 20040159883 - Suzuki, Norio ; et al. | 2004-08-19 |
Semiconductor Integrated Circuitry And Method For Manufacturing The Circuitry
App 20040147077 - Watanabe, Kozo ; et al. | 2004-07-29 |
Semiconductor integrated circuit device and the process of manufacturing the same having poly-silicon plug, wiring trenches and bit lines formed in the wiring trenches having a width finer than a predetermined size
App 20040140495 - Uchiyama, Hiroyuki ; et al. | 2004-07-22 |
Semiconductor Integrated Circuit Device And The Process Of Manufacturing The Same Having Poly-silicon Plug, Wiring Trenches And Bit Lines Formed In The Wiring Trenches Having A Width Finer Than A Predetermined Size
Grant 6,762,449 - Uchiyama , et al. July 13, 2 | 2004-07-13 |
Semiconductor integrated circuitry and method for manufacturing the circuitry
Grant 6,743,673 - Watanabe , et al. June 1, 2 | 2004-06-01 |
Semiconductor integrated circuit device and the method of producing the same
Grant 6,734,479 - Ogishima , et al. May 11, 2 | 2004-05-11 |
Semiconductor integrated circuit device and method of manufacturing involving the scale-down width of shallow groove isolation using round processing
Grant 6,720,234 - Suzuki , et al. April 13, 2 | 2004-04-13 |
Semiconductor integrated circuit device and method of manufacturing involving the scale-down width of shallow groove isolation using round processing
App 20030148587 - Suzuki, Norio ; et al. | 2003-08-07 |
Process for multilayer wiring connections and bonding pad adhesion to dielectric in a semiconductor integrated circuit device
Grant 6,573,170 - Aoyagi , et al. June 3, 2 | 2003-06-03 |
Semiconductor integrated circuit device and method of manufacturing involving the scale-down width of shallow groove isolation using round processing
Grant 6,562,695 - Suzuki , et al. May 13, 2 | 2003-05-13 |
Semiconductor integrated circuit device
App 20030042518 - Uchiyama, Hiroyuki ; et al. | 2003-03-06 |
Semiconductor integrated circuit device and method for manufacturing the same
Grant 6,503,794 - Watanabe , et al. January 7, 2 | 2003-01-07 |
Semiconductor integrated circuitry and method for manufacturing the circuitry
App 20020137281 - Watanabe, Kozo ; et al. | 2002-09-26 |
Semiconductor integrated circuit device and the process of manufacturing the same
App 20020084477 - Uchiyama, Hiroyuki ; et al. | 2002-07-04 |
Method of manufacturing semiconductor devices
App 20020055261 - Nishida, Akio ; et al. | 2002-05-09 |
Semiconductor integrated circuit device including an interlayer insulating film formed under a bonding pad and arranged to prevent peeling of the bonding pad
App 20020003305 - Umakoshi, Masashi ; et al. | 2002-01-10 |
Method of manufacturing semiconductor devices
App 20010053597 - Nishida, Akio ; et al. | 2001-12-20 |
Method of forming a MISFET device with a bit line completely surrounded by dielectric
Grant 6,287,914 - Uchiyama , et al. September 11, 2 | 2001-09-11 |
Semiconductor integrated circuit device and process for manufacturing the same
App 20010005624 - Aoyagi, Takashi ; et al. | 2001-06-28 |
Semiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the same
Grant 5,917,211 - Murata , et al. June 29, 1 | 1999-06-29 |
Semiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the same
Grant 5,734,188 - Murata , et al. March 31, 1 | 1998-03-31 |
| 