Ogino; Yuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ogino; Yuki.The latest application filed is for "microetching agent for copper, copper surface roughening method and wiring board production method".

Company Profile

2.4.6

Ogino; Yuki - Hyogo JP
Ogino; Yuki - Amagasaki-shi JP
Ogino; Yuki - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microetching agent for copper, copper surface roughening method and wiring board production method Grant 11,208,726 - Ogino , et al. December 28, 2	2021-12-28
Microetching Agent For Copper, Copper Surface Roughening Method And Wiring Board Production Method App 20200263308 - OGINO; Yuki ; et al.	2020-08-20
Etching Method App 20200109475 - Ogino; Yuki ; et al.	2020-04-09
Etching Liquid And Etching Method App 20180044801 - Ogino; Yuki ; et al.	2018-02-15
Display device Grant 9,678,375 - Mori , et al. June 13, 2	2017-06-13
Microetching solution for copper, replenishment solution therefor and method for production of wiring board Grant 9,011,712 - Kurii , et al. April 21, 2	2015-04-21
Microetching Solution For Copper, Replenishment Solution Therefor And Method For Production Of Wiring Board App 20140326696 - Kurii; Masayo ; et al.	2014-11-06
Display Device App 20140192290 - MORI; Yasuhiro ; et al.	2014-07-10
Liquid crystal module Grant 7,965,348 - Ogino June 21, 2	2011-06-21
Liquid Crystal Module App 20090079898 - OGINO; Yuki	2009-03-26

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