Ogihara; Satoru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ogihara; Satoru.The latest application filed is for "additive composition for orally disintegrating tablet".
- Ogihara; Satoru - Osaka JP
- Ogihara; Satoru - Hitachi JP
| Patent | Date |
|---|---|
| Additive composition for orally disintegrating tablet Grant 11,173,122 - Higashiyama , et al. November 16, 2 | 2021-11-16 |
| Additive composition for orally disintegrating tablet Grant 11,167,031 - Higashiyama , et al. November 9, 2 | 2021-11-09 |
| Additive Composition For Orally Disintegrating Tablet App 20190201529 - HIGASHIYAMA; Yoichi ; et al. | 2019-07-04 |
| Additive Composition For Orally Disintegrating Tablet App 20190151247 - HIGASHIYAMA; Yoichi ; et al. | 2019-05-23 |
| Ceramic multilayer circuit board and semiconductor module Grant RE34,887 - Ushifusa , et al. March 28, 1 | 1995-03-28 |
| Mounting substrate Grant 5,350,886 - Miyazaki , et al. September 27, 1 | 1994-09-27 |
| Method for producing multilayer ceramic body with convex side faces Grant 5,277,723 - Kodama , et al. January 11, 1 | 1994-01-11 |
| Installation structure of integrated circuit devices Grant 5,045,922 - Kodama , et al. September 3, 1 | 1991-09-03 |
| Ceramic laminated circuit substrate Grant 4,998,159 - Shinohara , et al. March 5, 1 | 1991-03-05 |
| Semiconductor chip module Grant 4,970,577 - Ogihara , et al. November 13, 1 | 1990-11-13 |
| Integrated circuit package having heat sink bonded with resinous adhesive Grant 4,965,660 - Ogihara , et al. October 23, 1 | 1990-10-23 |
| Chip carrier Grant 4,954,877 - Nakanishi , et al. September 4, 1 | 1990-09-04 |
| Condenser-containing, ceramic multi-layer circuit board and semiconductor module and computer having the circuit board Grant 4,858,077 - Shinohara , et al. August 15, 1 | 1989-08-15 |
| Ceramic multilayer circuit board and semiconductor module Grant 4,821,142 - Ushifusa , et al. April 11, 1 | 1989-04-11 |
| Electrical insulating, sintered aluminum nitride body having a high thermal conductivity and process for preparing the same Grant 4,796,077 - Takeda , et al. January 3, 1 | 1989-01-03 |
| Process for producing a ceramic multi-layer circuit board Grant 4,764,233 - Ogihara , et al. August 16, 1 | 1988-08-16 |
| Ceramic body glass composition for bonding and filling ceramic parts thereof Grant 4,741,849 - Naito , et al. May 3, 1 | 1988-05-03 |
| Multilayered ceramic wiring circuit board and the method of producing the same Grant 4,736,276 - Ushifusa , et al. April 5, 1 | 1988-04-05 |
| Integrated circuit package with low-thermal expansion lead pieces Grant 4,729,010 - Tsuchiya , et al. March 1, 1 | 1988-03-01 |
| Nonlinear voltage dependent resistor and method for manufacturing thereof Grant 4,692,735 - Shoji , et al. September 8, 1 | 1987-09-08 |
| Multilayer ceramic circuit board Grant 4,672,152 - Shinohara , et al. June 9, 1 | 1987-06-09 |
| Multi-layer ceramic substrate and method for the production thereof Grant 4,624,896 - Watanabe , et al. November 25, 1 | 1986-11-25 |
| Multi-layer ceramic wiring circuit board and process for producing the same Grant 4,620,264 - Ushifusa , et al. October 28, 1 | 1986-10-28 |
| Multilayered ceramic circuit board Grant 4,598,167 - Ushifusa , et al. July 1, 1 | 1986-07-01 |
| Electrically insulating silicon carbide sintered body Grant 4,561,010 - Ogihara , et al. December 24, 1 | 1985-12-24 |
| Sintered aluminum nitride and semi-conductor device using the same Grant 4,540,673 - Takeda , et al. September 10, 1 | 1985-09-10 |
| Multilayer circuit board Grant 4,299,873 - Ogihara , et al. November 10, 1 | 1981-11-10 |
| Process for producing transparent conductive film Grant 4,252,841 - Kinugawa , et al. February 24, 1 | 1981-02-24 |
| Liquid crystal display element Grant 4,252,414 - Kinugawa , et al. February 24, 1 | 1981-02-24 |
| Process for producing liquid crystal display element Grant 4,238,276 - Kinugawa , et al. December 9, 1 | 1980-12-09 |
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