| Patent | Date |
|---|
Data detection mitigation in printed circuit boards
Grant 11,244,079 - Cocchini , et al. February 8, 2 | 2022-02-08 |
Data Detection Mitigation In Printed Circuit Boards
App 20210081576 - Cocchini; Matteo ; et al. | 2021-03-18 |
Secure signal integrity
Grant 10,762,243 - Oggioni , et al. Sep | 2020-09-01 |
Circuitized substrate with electronic components mounted on transversal portion thereof
Grant 10,622,295 - Brunschwiler , et al. | 2020-04-14 |
Circuitized substrate with electronic components mounted on transversal portion thereof
Grant 10,622,296 - Brunschwiler , et al. | 2020-04-14 |
Secure signal integrity
Grant 10,496,851 - Oggioni , et al. De | 2019-12-03 |
Circuitized Substrate With Electronic Components Mounted On Transversal Portion Thereof
App 20180315696 - Brunschwiler; Thomas J. ; et al. | 2018-11-01 |
Circuitized Substrate With Electronic Components Mounted On Transversal Portion Thereof
App 20180315697 - Brunschwiler; Thomas J. ; et al. | 2018-11-01 |
Circuitized substrate with electronic components mounted on transversal portion thereof
Grant 10,068,839 - Brunschwiler , et al. September 4, 2 | 2018-09-04 |
Dense assembly of laterally soldered, overmolded chip packages
Grant 10,008,474 - Brunschwiler , et al. June 26, 2 | 2018-06-26 |
Dense Assembly of Laterally Soldered, Overmolded Chip Packages
App 20180012864 - BRUNSCHWILER; Thomas J. ; et al. | 2018-01-11 |
Circuitized Substrate With Electronic Components Mounted On Transversal Portion Thereof
App 20180005934 - Brunschwiler; Thomas J. ; et al. | 2018-01-04 |
Integrated helical multi-layer inductor structures
Grant 9,397,042 - Brunschwiler , et al. July 19, 2 | 2016-07-19 |
Computer program product for electro-optical assembly
Grant 9,323,009 - Oggioni , et al. April 26, 2 | 2016-04-26 |
Fabricating an optical assembly
Grant 9,274,289 - Oggioni , et al. March 1, 2 | 2016-03-01 |
Integrated helical multi-layer inductor structures
App 20150206838 - BRUNSCHWILER; THOMAS J. ; et al. | 2015-07-23 |
Method for attaching a flexible structure to a device and a device having a flexible structure
Grant 9,055,681 - Dangel , et al. June 9, 2 | 2015-06-09 |
Method for fabricating an electro-optical assembly
Grant 8,926,197 - Oggioni , et al. January 6, 2 | 2015-01-06 |
Computer program product for electro-optical assembly
Grant 8,870,472 - Oggioni , et al. October 28, 2 | 2014-10-28 |
Electro-optical Assembly Fabrication
App 20140208571 - Oggioni; Stefano Sergio ; et al. | 2014-07-31 |
Electro-optical assembly fabrication
Grant 8,444,328 - Oggioni , et al. May 21, 2 | 2013-05-21 |
Electro-optical Assembly Fabrication
App 20130067733 - Oggioni; Stefano Sergio ; et al. | 2013-03-21 |
Electro-optical Assembly Fabrication
App 20130067715 - Oggioni; Stefano Sergio ; et al. | 2013-03-21 |
Electro-optical Assembly Fabrication
App 20130067739 - Oggioni; Stefano Sergio ; et al. | 2013-03-21 |
Method For Attaching A Flexible Structure To A Device And A Device Having A Flexible Structure
App 20120279763 - Dangel; Roger ; et al. | 2012-11-08 |
Method for attaching a flexible structure to a device
Grant 8,286,345 - Dangel , et al. October 16, 2 | 2012-10-16 |
Electro-optical Assembly Fabrication
App 20110138600 - Oggioni; Stefano Sergio ; et al. | 2011-06-16 |
Tamper-proof structures for protecting electronic modules
Grant 7,915,540 - Oggioni March 29, 2 | 2011-03-29 |
Method for manufacturing a tamper-proof cap for an electronic module
Grant 7,788,801 - Oggioni , et al. September 7, 2 | 2010-09-07 |
Method and system for prototyping electronic devices with multi-configuration CHIP carriers
Grant 7,783,998 - Oggioni August 24, 2 | 2010-08-24 |
Method of embedding tamper proof layers and discrete components into printed circuit board stack-up
Grant 7,703,201 - Oggioni , et al. April 27, 2 | 2010-04-27 |
Method For Attaching A Flexible Structure To A Device And A Device Having A Flexible Structure
App 20090188108 - Dangel; Roger ; et al. | 2009-07-30 |
Method for attaching a flexible structure to a device and a device having a flexible structure
Grant 7,523,547 - Dangel , et al. April 28, 2 | 2009-04-28 |
Handling and positioning of metallic plated balls for socket application in ball grid array packages
Grant 7,524,698 - Viero , et al. April 28, 2 | 2009-04-28 |
Method And System For Prototyping Electronic Devices With Multi-configuration Chip Carriers
App 20080209378 - Oggioni; Stefano Sergio | 2008-08-28 |
Tamper-proof Structures For Protectig Electronic Modules
App 20080036598 - Oggioni; Stefano Sergio | 2008-02-14 |
Method For Attaching A Flexible Structure To A Device And A Device Having A Flexible Structure
App 20070205479 - Dangel; Roger ; et al. | 2007-09-06 |
Tamper-proof Caps For Large Assembly
App 20070038865 - Oggioni; Stefano Sergio ; et al. | 2007-02-15 |
Handling And Positioning Of Metallic Plated Balls For Socket Application In Ball Grid Array Packages
App 20060255461 - Viero; Giorgio ; et al. | 2006-11-16 |
Metallic Plating For Socket Applicationin Ball Grid Array Packages
App 20060196917 - Viero; Giorgio ; et al. | 2006-09-07 |
Method Of Embedding Tamper Proof Layers Anddiscrete Components Into Printed Circuit Board Stack-up
App 20060086534 - Oggioni; Stefano Sergio ; et al. | 2006-04-27 |
Electronic device carrier adapted for transmitting high frequency signals
Grant 7,015,574 - Alcoe , et al. March 21, 2 | 2006-03-21 |
Module Power Distribution Network
App 20050167811 - Frech, Roland ; et al. | 2005-08-04 |
Reworkable and thermally conductive adhesive and use thereof
Grant 6,777,817 - Buchwalter , et al. August 17, 2 | 2004-08-17 |
Reworkable and thermally conductive adhesive and use thereof
App 20040041280 - Buchwalter, Stephen L. ; et al. | 2004-03-04 |
Reworkable and thermally conductive adhesive and use thereof
Grant 6,617,698 - Buchwalter , et al. September 9, 2 | 2003-09-09 |
Reworkable and thermally conductive adhesive and use thereof
App 20020171132 - Buchwalter, Stephen ; et al. | 2002-11-21 |
| 