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OGAWA; Taku Patent Filings

OGAWA; Taku

Patent Applications and Registrations

Patent applications and USPTO patent grants for OGAWA; Taku.The latest application filed is for "photosensitive resin composition, method for forming resist pattern, and method for producing plated formed product".

Company Profile
0.7.10
  • OGAWA; Taku - Minato-ku Tokyo
  • Ogawa; Taku - Kyoto JP
  • Ogawa; Taku - Kounosu JP
  • OGAWA; Taku - Kounosu-shi JP
  • Ogawa; Taku - Kounosu-city JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Photosensitive Resin Composition, Method For Forming Resist Pattern, And Method For Producing Plated Formed Product
App 20220146932 - NODA; Hiroto ;   et al.
2022-05-12
X-ray imaging apparatus
Grant 11,324,461 - Ogawa , et al. May 10, 2
2022-05-10
X-ray Imaging Apparatus
App 20200359977 - OGAWA; Taku ;   et al.
2020-11-19
Electromagnetic contactor manufacturing method
Grant 9,378,906 - Imamura , et al. June 28, 2
2016-06-28
Electromagnetic contactor and electromagnetic contactor gas encapsulating method
Grant 8,952,772 - Imamura , et al. February 10, 2
2015-02-10
Electromagnetic contactor and electromagnetic contactor gas encapsulating method
Grant 8,803,642 - Imamura , et al. August 12, 2
2014-08-12
Electromagnetic Contactor Manufacturing Method
App 20140101937 - IMAMURA; Seiji ;   et al.
2014-04-17
Electromagnetic Contactor And Electromagnetic Contactor Gas Encapsulating Method
App 20140104018 - IMAMURA; Seiji ;   et al.
2014-04-17
Electromagnetic Contactor And Electromagnetic Contactor Gas Encapsulating Method
App 20140104019 - IMAMURA; Seiji ;   et al.
2014-04-17
Electromagnetic Contactor, Electromagnetic Contactor Gas Encapsulating Method, And Electromagnetic Contactor Manufacturing Method
App 20130234813 - Imamura; Seiji ;   et al.
2013-09-12

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