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Ogawa; Shizue Patent Filings

Ogawa; Shizue

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ogawa; Shizue.The latest application filed is for "substrate processing apparatus".

Company Profile
0.3.2
  • Ogawa; Shizue - Toyama JP
  • Ogawa; Shizue - Toyama-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Substrate processing apparatus
Grant 8,518,182 - Ogawa , et al. August 27, 2
2013-08-27
Substrate Processing Apparatus
App 20110209664 - Ogawa; Shizue ;   et al.
2011-09-01
Substrate processing apparatus
Grant 7,958,842 - Ogawa , et al. June 14, 2
2011-06-14
Substrate Processing Apparatus
App 20080153308 - Ogawa; Shizue ;   et al.
2008-06-26

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