OGAWA; Minoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for OGAWA; Minoru.The latest application filed is for "guidewire with conductive element".

Company Profile

1.24.14

OGAWA; Minoru - Seto-shi JP
OGAWA; Minoru - Aichi JP
Ogawa; Minoru - Tokyo N/A JP
Ogawa; Minoru - Hiki-gun JP
Ogawa; Minoru - Kariya JP
Ogawa; Minoru - Gifu JP
Ogawa; Minoru - Shiga JP
Ogawa; Minoru - Aichi-ken JP
Ogawa; Minoru - Toda JP
Ogawa, Minoru - Saitama JP
Ogawa; Minoru - Tagata-gun JP
Ogawa; Minoru - Shizuoka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Guidewire With Conductive Element App 20220181827 - PATIL; Nitin ; et al.	2022-06-09
Guide Wire With Conductive Element App 20220111182 - PATIL; Nitin ; et al.	2022-04-14
Defectless hydrogen separation membrane, production method for defectless hydrogen separation membrane and hydrogen separation method Grant 9,149,762 - Matsumura , et al. October 6, 2	2015-10-06
Printed matter, image processing apparatus, printed matter authenticity determination apparatus, image processing method, printed matter authenticity determination method, and program Grant 8,452,044 - Yogo , et al. May 28, 2	2013-05-28
Defectless Hydrogen Separation Membrane, Production Method For Defectless Hydrogen Separation Membrane And Hydrogen Separation Method App 20130092025 - Matsumura; Yasuyuki ; et al.	2013-04-18
Automobile and/or toy replica thereof Grant D666,945 - Ogawa , et al. September 11, 2	2012-09-11
Printed circuit board assembly and method of manufacturing the same Grant 8,031,474 - Ogawa , et al. October 4, 2	2011-10-04
Printed Matter, Image Processing Apparatus, Printed Matter Authenticity Determination Apparatus, Image Processing Method, Printed Matter Authenticity Determination Method, And Program App 20100021002 - Yogo; Yoshio ; et al.	2010-01-28
Multilayer wiring board and fabricating method of the same Grant 7,642,468 - Nakada , et al. January 5, 2	2010-01-05
Sheet Cutting Machine App 20090288537 - Hirayama; Hisahiro ; et al.	2009-11-26
Automobile and/or toy replica thereof Grant D576,919 - Ito , et al. September 16, 2	2008-09-16
Method of Manufacturing Multilayer Wiring Board App 20080116611 - Ogawa; Minoru ; et al.	2008-05-22
Front bumper for an automobile Grant D563,847 - Sowa , et al. March 11, 2	2008-03-11
Method of manufacturing multilayer wiring board Grant 7,334,324 - Ogawa , et al. February 26, 2	2008-02-26
Front grille for an automobile Grant D562,740 - Ogawa , et al. February 26, 2	2008-02-26
Front grille for an automobile Grant D562,195 - Ito , et al. February 19, 2	2008-02-19
Printed Circuit Board Assembly And Method Of Manufacturing The Same App 20070176613 - Ogawa; Minoru ; et al.	2007-08-02
Rear bumper for an automobile Grant D535,592 - Ogawa , et al. January 23, 2	2007-01-23
Multilayer Wiring Board And Fabricating Method Of The Same App 20060274510 - Nakada; Masakazu ; et al.	2006-12-07
Liftgate panel for an automobile Grant D532,732 - Ogawa , et al. November 28, 2	2006-11-28
Motor vehicle and/or toy replica thereof Grant D528,944 - Hara , et al. September 26, 2	2006-09-26
Motor vehicle and/or toy replica thereof Grant D528,474 - Hara , et al. September 19, 2	2006-09-19
Rear combination lamp lens for an automobile Grant D527,839 - Hara , et al. September 5, 2	2006-09-05
Solid acid catalyst containing platinum group metal component and method for preparation thereof Grant 7,026,268 - Furuta , et al. April 11, 2	2006-04-11
Semiconductor device integrated multilayer wiring board Grant 7,022,399 - Ogawa , et al. April 4, 2	2006-04-04
Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board App 20050025944 - Ogawa, Minoru ; et al.	2005-02-03
Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board Grant 6,797,367 - Ogawa , et al. September 28, 2	2004-09-28
Solid acid catalyst containing plantinum group metal component and method for preparation thereof App 20040067845 - Furuta, Satoshi ; et al.	2004-04-08
Pipe joint, its manufacturing method, and fluid device using the same Grant 6,626,468 - Ogawa September 30, 2	2003-09-30
Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board App 20030180510 - Ogawa, Minoru ; et al.	2003-09-25
Semiconductor device built-in multilayer wiring board and method of manufacturing same App 20030178726 - Ogawa, Minoru ; et al.	2003-09-25
Pipe joint, its manufacturing method, and fluid device using the same App 20020043801 - Ogawa, Minoru	2002-04-18
Photographic processing system Grant 6,031,596 - Ishii , et al. February 29, 2	2000-02-29
Photoelectric conversion device Grant 4,979,007 - Ogawa , et al. December 18, 1	1990-12-18
Photoelectric conversion element image sensor with combined field effect transistor having compact size Grant 4,827,146 - Ogawa , et al. May 2, 1	1989-05-02

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.