Ogawa; Michiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ogawa; Michiro.The latest application filed is for "electronic component-embedded substrate and electronic component device".

Company Profile

1.9.8

Ogawa; Michiro - Nagano JP
Ogawa; Michiro - Nagano-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic component-embedded substrate and electronic component device Grant 10,524,361 - Ogawa Dec	2019-12-31
Electronic Component-embedded Substrate And Electronic Component Device App 20190246502 - Ogawa; Michiro	2019-08-08
Electronic component device Grant 9,257,373 - Nakamura , et al. February 9, 2	2016-02-09
Wiring substrate, method for manufacturing the wiring substrate, and semiconductor package Grant 9,232,642 - Nakamura , et al. January 5, 2	2016-01-05
Method of manufacturing a wiring board having pads highly resistant to peeling Grant 9,024,207 - Ogawa , et al. May 5, 2	2015-05-05
Electronic Component Device App 20140145317 - NAKAMURA; Junichi ; et al.	2014-05-29
Wiring board and electronic component device Grant 8,686,298 - Nakamura , et al. April 1, 2	2014-04-01
Wiring Substrate, Method For Manufacturing The Wiring Substrate, And Semiconductor Package App 20140021625 - NAKAMURA; Junichi ; et al.	2014-01-23
Wiring Board And Method Of Manufacturing The Same App 20130185936 - Ogawa; Michiro ; et al.	2013-07-25
Wiring Board And Method Of Manufacturing The Same App 20130153271 - Ogawa; Michiro ; et al.	2013-06-20
Wiring board and method of manufacturing the same Grant 8,399,779 - Ogawa , et al. March 19, 2	2013-03-19
Wiring Board And Electronic Component Device App 20120145437 - Nakamura; Junichi ; et al.	2012-06-14
Wiring board and electronic component device Grant 8,153,902 - Nakamura , et al. April 10, 2	2012-04-10
Wiring Board And Electronic Component Device App 20100132993 - NAKAMURA; Junichi ; et al.	2010-06-03
Wiring Board And Method Of Manufacturing The Same App 20100065322 - Ogawa; Michiro ; et al.	2010-03-18

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.