Ogawa; Mamoru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ogawa; Mamoru.The latest application filed is for "fluid line coupling".
- Ogawa; Mamoru - Isehara JP
- Ogawa; Mamoru - Isehara-City JP
- Ogawa; Mamoru - Shiga-ken JP
- Ogawa; Mamoru - Moriyama JP
- Ogawa, Mamoru - Moriyama-shi JP
| Patent | Date |
|---|---|
| Fluid line coupling Grant 8,205,912 - Takenaka , et al. June 26, 2 | 2012-06-26 |
| Fluid Line Coupling App 20100148491 - Takenaka; Yasuki ; et al. | 2010-06-17 |
| Method of producing multilayer piezoelectric resonator Grant 6,912,761 - Yasugi , et al. July 5, 2 | 2005-07-05 |
| Method of forming an electronic component located on a surface of a package member with a space therebetween Grant 6,871,388 - Ishino , et al. March 29, 2 | 2005-03-29 |
| Apparatus having an electronic component located on a surface of a package member with a space therebetween App 20030076010 - Ishino, Satoshi ; et al. | 2003-04-24 |
| Method of producing multilayer piezoelectric resonator App 20030070271 - Yasugi, Toshiyuki ; et al. | 2003-04-17 |
| Apparatus having an electronic component located on a surface of a package member with a space therebetween Grant 6,507,139 - Ishino , et al. January 14, 2 | 2003-01-14 |
| Piezoelectric resonator and electronic component including same Grant 6,097,134 - Kawabata , et al. August 1, 2 | 2000-08-01 |
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