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Game control device, game system, and information storage medium Grant 10,773,154 - Nakamura , et al. Sept | 2020-09-15 |
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Game Control Device, Game System, And Information Storage Medium App 20190262700 - NAKAMURA; Masaki ;   et al. | 2019-08-29 |
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Semiconductor Device App 20160005727 - YAMAMACHI; Shintaro ;   et al. | 2016-01-07 |
Semiconductor device Grant 9,165,879 - Yamamichi , et al. October 20, 2 | 2015-10-20 |
Semiconductor Device App 20140361411 - Yamamichi; Shintaro ;   et al. | 2014-12-11 |
Semiconductor device including a recess formed above a semiconductor chip Grant 8,810,021 - Nakashiba , et al. August 19, 2 | 2014-08-19 |
External Storage Device And Method Of Manufacturing External Storage Device App 20140191363 - Nakashiba; Yasutaka ;   et al. | 2014-07-10 |
Semiconductor device Grant 8,772,914 - Nakashiba , et al. July 8, 2 | 2014-07-08 |
Method of manufacturing a semiconductor device Grant 8,753,922 - Nakashiba , et al. June 17, 2 | 2014-06-17 |
External storage device and method of manufacturing external storage device Grant 8,705,238 - Nakashiba , et al. April 22, 2 | 2014-04-22 |
Method Of Manufacturing A Semiconductor Device App 20130130442 - NAKASHIBA; Yasutaka ;   et al. | 2013-05-23 |
Semiconductor Device App 20130127033 - NAKASHIBA; Yasutaka ;   et al. | 2013-05-23 |
Electronic Component And Method Of Manufacturing Electronic Component App 20130122662 - Matsumaru; Yasuhiro ;   et al. | 2013-05-16 |
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Semiconductor Device And Communication Method App 20130043558 - NAKASHIBA; Yasutaka ;   et al. | 2013-02-21 |
Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof Grant 8,378,470 - Nakashiba , et al. February 19, 2 | 2013-02-19 |
Electronic component having an authentication pattern Grant 8,357,935 - Matsumaru , et al. January 22, 2 | 2013-01-22 |
Semiconductor device and communication method Grant 8,283,770 - Nakashiba , et al. October 9, 2 | 2012-10-09 |
Electronic component and method of manufacturing electronic component App 20120043648 - MATSUMARU; Yasuhiro ;   et al. | 2012-02-23 |
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Semiconductor Device And Communication Method App 20110143662 - Nakashiba; Yasutaka ;   et al. | 2011-06-16 |
External storage device and method of manufacturing external storage device App 20110141681 - Nakashiba; Yasutaka ;   et al. | 2011-06-16 |
Method Of Manufacturing A Wiring Board App 20110136298 - KIKUCHI; Katsumi ;   et al. | 2011-06-09 |
Wiring board, semiconductor device using wiring board and their manufacturing methods Grant 7,911,038 - Kikuchi , et al. March 22, 2 | 2011-03-22 |
Semiconductor Device, Method Of Manufacturing Semiconductor Device, And Lead Frame Thereof App 20110049693 - NAKASHIBA; Yasutaka ;   et al. | 2011-03-03 |
Wiring board, method for manufacturing same, and semiconductor package Grant 7,838,779 - Yamamichi , et al. November 23, 2 | 2010-11-23 |
Semiconductor Device And Method Of Manufacturing The Same App 20100258955 - MIYAGAWA; YUICHI ;   et al. | 2010-10-14 |
Wiring Board Composite Body, Semiconductor Device, And Method For Manufacturing The Wiring Board Composite Body And The Semiconductor Device App 20100232127 - Mori; Kentaro ;   et al. | 2010-09-16 |
Interconnecting substrate and semiconductor device Grant 7,745,736 - Ogawa , et al. June 29, 2 | 2010-06-29 |
Method of manufacturing a wiring substrate and semiconductor device Grant 7,701,726 - Tsukano , et al. April 20, 2 | 2010-04-20 |
Wiring board and method for manufacturing the same Grant 7,674,989 - Kikuchi , et al. March 9, 2 | 2010-03-09 |
Method Of Manufacturing Electronic Components Having Bump App 20100044416 - OGAWA; Kenta | 2010-02-25 |
Wiring substrate, semiconductor device, and method of manufacturing the same Grant 7,649,749 - Tsukano , et al. January 19, 2 | 2010-01-19 |
Wiring Board, Semiconductor Device Using Wiring Board And Their Manufacturing Methods App 20090315190 - Kikuchi; Katsumi ;   et al. | 2009-12-24 |
Method Of Manufacturing A Wiring Substrate And Semiconductor Device App 20090137085 - TSUKANO; Jun ;   et al. | 2009-05-28 |
Wiring substrate, semiconductor device, and method of manufacturing the same App 20080012140 - Tsukano; Jun ;   et al. | 2008-01-17 |
Electronic device with lead-free metal thin film formed on the surface thereof App 20070243405 - OGAWA; KENTA | 2007-10-18 |
Electronic device having external terminals with lead-free metal thin film formed on the surface thereof Grant 7,235,309 - Ogawa June 26, 2 | 2007-06-26 |
Wiring board and method for manufacturing the same App 20060283629 - Kikuchi; Katsumi ;   et al. | 2006-12-21 |
Wiring board, method for manufacturing same, and semiconductor package App 20060283625 - Yamamichi; Shintaro ;   et al. | 2006-12-21 |
Interconnecting substrate and semiconductor device App 20060192287 - Ogawa; Kenta ;   et al. | 2006-08-31 |
Electronic component and method of manufacturing the same Grant 6,884,523 - Ogawa April 26, 2 | 2005-04-26 |
Electronic Component And Method Of Manufacturing The Same App 20050056446 - Ogawa, Kenta | 2005-03-17 |
Electronic device having external terminals with lead-free metal thin film formed on the surface thereof App 20040126268 - Ogawa, Kenta | 2004-07-01 |
Semiconductor device and method for fabricating the same App 20030193094 - Takahashi, Nobuaki ;   et al. | 2003-10-16 |
Electronic component and method of manufacturing same App 20030156395 - Ogawa, Kenta | 2003-08-21 |