Ogawa; Kazuto

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ogawa; Kazuto.The latest application filed is for "encapsulating resin composition, semiconductor device using the encapsulating resin composition, and method for manufacturing semiconductor device using the encapsulating resin composition".

Company Profile

0.13.20

Ogawa; Kazuto - Nagaokakyo JP
Ogawa; Kazuto - Kyoto JP
Ogawa; Kazuto - Tokyo JP
Ogawa; Kazuto - Miyagi JP
Ogawa; Kazuto - Kurokawa-gun JP
OGAWA; Kazuto - Nagaokakyo-shi JP
Ogawa; Kazuto - Setagaya-ku JP
Ogawa; Kazuto - Yoshida-gun JP
Ogawa; Kazuto - Yamanashi JP
Ogawa; Kazuto - Nirasaki JP
Ogawa; Kazuto - Yamanashi-ken JP
Ogawa, Kazuto - Zama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic component unit and manufacturing method therefor Grant 9,978,515 - Ogawa , et al. May 22, 2	2018-05-22
Encapsulating resin composition, semiconductor device using the encapsulating resin composition, and method for manufacturing semiconductor device using the encapsulating resin composition Grant 9,932,473 - Iwatani , et al. April 3, 2	2018-04-03
Method of producing electronic components and method of producing substrate-type terminals Grant 9,839,135 - Ogawa , et al. December 5, 2	2017-12-05
Method of producing electronic components Grant 9,801,283 - Ogawa , et al. October 24, 2	2017-10-24
Sealing epoxy resin composition, hardened product, and semiconductor device Grant 9,633,922 - Ogawa , et al. April 25, 2	2017-04-25
Encapsulating Resin Composition, Semiconductor Device Using The Encapsulating Resin Composition, And Method For Manufacturing Semiconductor Device Using The Encapsulating Resin Composition App 20160289443 - IWATANI; EMI ; et al.	2016-10-06
Semiconductor device manufacturing method Grant 9,449,838 - Ogawa , et al. September 20, 2	2016-09-20
Sealing Epoxy Resin Composition, Hardened Product, And Semiconductor Device App 20160260645 - OGAWA; KAZUTO ; et al.	2016-09-08
Plasma processing method and plasma processing apparatus Grant 9,396,960 - Ogawa , et al. July 19, 2	2016-07-19
Plasma Processing Method And Plasma Processing Apparatus App 20150287618 - MATSUMOTO; Hiroie ; et al.	2015-10-08
Plasma Processing Method And Plasma Processing Apparatus App 20150243521 - Ogawa; Kazuto ; et al.	2015-08-27
Semiconductor Device Manufacturing Method App 20150228500 - OGAWA; Kazuto ; et al.	2015-08-13
Plasma processing method and plasma processing apparatus Grant 9,099,285 - Matsumoto , et al. August 4, 2	2015-08-04
Semiconductor device manufacturing method Grant 9,082,720 - Ogawa , et al. July 14, 2	2015-07-14
Semiconductor device manufacturing method Grant 9,039,913 - Ogawa , et al. May 26, 2	2015-05-26
Electronic Component Unit And Manufacturing Method Therefor App 20150096792 - OGAWA; Kazuto ; et al.	2015-04-09
Semiconductor Device Manufacturing Method App 20150056817 - Ogawa; Kazuto ; et al.	2015-02-26
Semiconductor Device Manufacturing Method App 20150037982 - OGAWA; Kazuto ; et al.	2015-02-05
Method Of Producing Electronic Components App 20150026973 - OGAWA; Kazuto ; et al.	2015-01-29
Method Of Producing Electronic Components And Method Of Producing Substrate-type Terminals App 20150026972 - OGAWA; Kazuto ; et al.	2015-01-29
Plasma Processing Method And Plasma Processing Apparatus App 20140120732 - MATSUMOTO; Hiroie ; et al.	2014-05-01
Integrated Broadcasting Communications Receiver And Resource Managing Device App 20140096154 - Ohtake; Go ; et al.	2014-04-03
Integrated Broadcasting Communications Receiver, Resource Access Controlling Program, And Integrated Broadcasting Communications System App 20140090019 - Ohmata; Hisayuki ; et al.	2014-03-27
Mounting structure for electronic component Grant 8,039,758 - Ogawa October 18, 2	2011-10-18
Processing Method App 20070298617 - Toda; Akihito ; et al.	2007-12-27
Processing method Grant 7,297,635 - Toda , et al. November 20, 2	2007-11-20
Etching method Grant 7,285,498 - Ogawa , et al. October 23, 2	2007-10-23
Mounting Structure For Electronic Component App 20070223206 - OGAWA; Kazuto	2007-09-27
Etching method App 20050085077 - Ogawa, Kazuto ; et al.	2005-04-21
Processing method App 20040259356 - Toda, Akihito ; et al.	2004-12-23
Watermarking application system for broadcast contents copyright protection App 20040025023 - Yamada, Takaaki ; et al.	2004-02-05

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