Ogawa, Eiichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ogawa, Eiichi.The latest application filed is for "disazo compound, reactive dye composition, and methods of dyeing cellulose or cellulose-containing fiber".
- Ogawa, Eiichi - Kitakatsushika-gun JP
- Ogawa; Eiichi - Saitama JP
- Ogawa; Eiichi - Kanagawa JP
| Patent | Date |
|---|---|
| Disazo compound, reactive dye composition, and methods of dyeing cellulose or cellulose-containing fiber App 20040117924 - Odani, Junji ; et al. | 2004-06-24 |
| Formazane compounds and method of dyeing using the same Grant 6,653,454 - Umeda , et al. November 25, 2 | 2003-11-25 |
| Method of bonding circuit boards Grant 5,545,281 - Matsui , et al. August 13, 1 | 1996-08-13 |
| Method of bonding circuit boards Grant 5,318,651 - Matsui , et al. June 7, 1 | 1994-06-07 |
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