Ogata; Sumikazu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ogata; Sumikazu.The latest application filed is for "abrasive material, method for producing same, and abrasive slurry containing same".
- Ogata; Sumikazu - Tokyo JP
- Ogata; Sumikazu - Ageo JP
- Ogata; Sumikazu - Saitama JP
- Ogata; Sumikazu - Ageo-shi JP
| Patent | Date |
|---|---|
| Abrasive material, method for producing same, and abrasive slurry containing same Grant 9,873,824 - Ogata , et al. January 23, 2 | 2018-01-23 |
| Abrasive Material, Method For Producing Same, And Abrasive Slurry Containing Same App 20160222265 - OGATA; Sumikazu ; et al. | 2016-08-04 |
| Conductive ink Grant 8,043,535 - Kamikoriyama , et al. October 25, 2 | 2011-10-25 |
| Conductive ink App 20090293766 - Kamikoriyama; Yoichi ; et al. | 2009-12-03 |
| Conductive Ink App 20080134936 - Kamikoriyama; Yoichi ; et al. | 2008-06-12 |
| Conductive Paste and Flexible Printed Wiring Board Produced Using the Conductive Paste App 20070256857 - Kamikoriyama; Yoichi ; et al. | 2007-11-08 |
| Aqueous nickel slurry, method for preparing the same and conductive paste Grant 6,746,628 - Kamikoriyama , et al. June 8, 2 | 2004-06-08 |
| Aqueous nickel slurry, method for preparing the same and conductive paste App 20030001142 - Kamikoriyama, Yoichi ; et al. | 2003-01-02 |
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