Ogata; Seiya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ogata; Seiya.The latest application filed is for "rotary cutting saw having abrasive segments in which wear-resistant grains are regularly arranged".
- Ogata; Seiya - Ukiha-gun JP
- Ogata; Seiya - Fukuoka-ken JP
- Ogata; Seiya - Fukuoka JP
| Patent | Date |
|---|---|
| Rotary cutting saw Grant 7,021,307 - Ogata April 4, 2 | 2006-04-04 |
| Rotary cutting saw having abrasive segments in which wear-resistant grains are regularly arranged Grant 6,615,816 - Ogata September 9, 2 | 2003-09-09 |
| Rotary cutting saw having abrasive segments in which wear-resistant grains are regularly arranged App 20030019489 - Ogata, Seiya | 2003-01-30 |
| Rotary cutting saw with slits shaped for minimizing wear of neck portion Grant 6,408,838 - Ogata , et al. June 25, 2 | 2002-06-25 |
| Process for the production of butanol and novel microorganism composition used therein Grant 4,443,542 - Hayashida , et al. April 17, 1 | 1984-04-17 |
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