Ogata; Masatsugu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ogata; Masatsugu.The latest application filed is for "semiconductor device".
- Ogata; Masatsugu - Hitachi JP
- Ogata, Masatsugu - Hitachi-shi JP
- Ogata; Masatsugu - Ibaraki-ken JP
| Patent | Date |
|---|---|
| Semiconductor device Grant 6,919,622 - Murakami , et al. July 19, 2 | 2005-07-19 |
| Semiconductor device App 20040155323 - Murakami, Gen ; et al. | 2004-08-12 |
| Semiconductor device Grant 6,720,208 - Murakami , et al. April 13, 2 | 2004-04-13 |
| Encapsulant of epoxy resin and liquid aromatic amine curing agent Grant 6,632,881 - Tsuchida , et al. October 14, 2 | 2003-10-14 |
| Semiconductor device App 20030127712 - Murakami, Gen ; et al. | 2003-07-10 |
| Semiconductor device App 20010008302 - Murakami, Gen ; et al. | 2001-07-19 |
| Laminate and multilayer printed circuit board Grant 6,114,005 - Nagai , et al. September 5, 2 | 2000-09-05 |
| Semiconductor device having all outer leads extending from one side of a resin member Grant 6,100,580 - Murakami , et al. August 8, 2 | 2000-08-08 |
| Semiconductor device Grant 6,081,023 - Murakami , et al. June 27, 2 | 2000-06-27 |
| Semiconductor device chip on lead and lead on chip manufacturing Grant 6,069,029 - Murakami , et al. May 30, 2 | 2000-05-30 |
| Laminate and multilayer printed circuit board Grant 5,677,045 - Nagai , et al. October 14, 1 | 1997-10-14 |
| Semiconductor device Grant 5,612,569 - Murakami , et al. March 18, 1 | 1997-03-18 |
| Stacked high mounting density semiconductor devices Grant 5,602,420 - Ogata , et al. February 11, 1 | 1997-02-11 |
| Semiconductor device Grant 5,530,286 - Murakami , et al. June 25, 1 | 1996-06-25 |
| Semiconductor device Grant 5,358,904 - Murakami , et al. * October 25, 1 | 1994-10-25 |
| Resin composition for encapsulating of semiconductor and semiconductor apparatus using of the same Grant 5,225,499 - Kokaku , et al. July 6, 1 | 1993-07-06 |
| Plastic molded type electronic device Grant 5,181,097 - Ogata , et al. January 19, 1 | 1993-01-19 |
| Semiconductor device Grant 5,068,712 - Murakami , et al. November 26, 1 | 1991-11-26 |
| Resin encapsulated semiconductor device Grant 4,965,657 - Ogata , et al. October 23, 1 | 1990-10-23 |
| Thermosetting resin composition, process for preparation thereof and cured product thereof Grant 4,393,177 - Ishii , et al. July 12, 1 | 1983-07-12 |
| Uninflammable dynamoelectric machine having coil windings and core encapsulated with unsaturated polyester resin-filler composition Grant 4,387,311 - Kobayashi , et al. June 7, 1 | 1983-06-07 |
| Resin molded stators Grant 4,352,897 - Ogata , et al. October 5, 1 | 1982-10-05 |
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