OGASHIWA; Toshinori

Patent Applications and Registrations

Patent applications and USPTO patent grants for OGASHIWA; Toshinori.The latest application filed is for "gold powder, production method for gold powder, and gold paste".

Company Profile

4.22.20

OGASHIWA; Toshinori - Isehara-shi JP
OGASHIWA; Toshinori - Hiratsuka-shi Kanagawa
Ogashiwa; Toshinori - Hiratsuka JP
Ogashiwa; Toshinori - Kanagawa JP
Ogashiwa; Toshinori - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Gold Powder, Production Method For Gold Powder, And Gold Paste App 20220219237 - OGASHIWA; Toshinori ; et al.	2022-07-14
Through-hole Sealing Structure And Sealing Method, And Transfer Substrate For Sealing Through-hole App 20220102228 - OGASHIWA; Toshinori ; et al.	2022-03-31
Structure and method for sealing through-hole, and transfer substrate for sealing through-hole Grant 10,870,151 - Ogashiwa , et al. December 22, 2	2020-12-22
Structure And Method For Sealing Through-hole, And Transfer Substrate For Sealing Through-hole App 20200230701 - OGASHIWA; Toshinori ; et al.	2020-07-23
Noble metal paste for bonding of semiconductor element Grant 10,366,963 - Miyairi , et al. July 30, 2	2019-07-30
Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate Grant 10,256,113 - Ogashiwa , et al.	2019-04-09
Package production method and package produced by the method Grant 10,125,015 - Ogashiwa , et al. November 13, 2	2018-11-13
Noble Metal Paste For Bonding Of Semiconductor Element App 20180151531 - Miyairi; Masayuki ; et al.	2018-05-31
Package Production Method And Package Produced By The Method App 20180044175 - OGASHIWA; Toshinori ; et al.	2018-02-15
Hermetic-sealing package member, production method therefor, and hermetically-sealed package production method using this hermetic-sealing package member Grant 9,561,952 - Ogashiwa , et al. February 7, 2	2017-02-07
Precious metal paste for bonding semiconductor element Grant 9,539,671 - Miyairi , et al. January 10, 2	2017-01-10
Airtight-sealing Package Member, Production Method Therefor, And Airtight-sealed Package Production Method Using This Airtight-sealing Package Member App 20160311677 - OGASHIWA; Toshinori ; et al.	2016-10-27
Through Electrode And Method For Producing Multilayer Substrate Using Through Electrode App 20160272488 - OGASHIWA; Toshinori ; et al.	2016-09-22
Resonator electrode material excellent in aging property, piezoelectric resonator using the same material, and sputtering target made of the same material Grant 9,065,418 - Ogashiwa , et al. June 23, 2	2015-06-23
Bump, method for forming the bump, and method for mounting substrate having the bump thereon Grant 8,962,471 - Ogashiwa , et al. February 24, 2	2015-02-24
Conductive Paste For Die Bonding, And Die Bonding Method With The Conductive Paste App 20150014399 - Ogashiwa; Toshinori ; et al.	2015-01-15
Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate Grant 8,912,088 - Ogashiwa , et al. December 16, 2	2014-12-16
Bump, Method For Forming The Bump, And Method For Mounting Substrate Having The Bump Thereon App 20140295619 - OGASHIWA; TOSHINORI ; et al.	2014-10-02
Transfer Substrate For Forming Metal Wiring Line And Method For Forming Metal Wiring Line By Means Of Said Transfer Substrate App 20140262003 - Ogashiwa; Toshinori ; et al.	2014-09-18
Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device Grant 8,558,433 - Ogashiwa , et al. October 15, 2	2013-10-15
Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device Grant 8,505,804 - Ogashiwa , et al. August 13, 2	2013-08-13
Transfer Substrate For Forming Metal Wiring And Method For Forming Metal Wiring Using Said Transfer Substrate App 20130196504 - Ogashiwa; Toshinori ; et al.	2013-08-01
Bump, method for forming the bump, and method for mounting substrate having the bump thereon Grant 8,492,894 - Ogashiwa , et al. July 23, 2	2013-07-23
Noble Metal Paste For Bonding Of Semiconductor Element App 20130168437 - Miyairi; Masayuki ; et al.	2013-07-04
Oscillator Electrode Material Having Excellent Aging Characteristics, Piezoelectric Oscillator Using The Material And Sputtering Target Comprising The Material App 20120248943 - Ogashiwa; Toshinori ; et al.	2012-10-04
Metal Paste For Sealing, Hermetic Sealing Method For Piezoelectric Element, And Piezoelectric Device App 20120212106 - Ogashiwa; Toshinori ; et al.	2012-08-23
Bump, Method For Forming The Bump, And Method For Mounting Substrate Having The Bump Thereon App 20110272802 - Ogashiwa; Toshinori ; et al.	2011-11-10
Method of bonding Grant 7,789,287 - Ogashiwa , et al. September 7, 2	2010-09-07
Metal Paste For Sealing, Hermetic Sealing Method For Piezoelectric Element, And Piezoelectric Device App 20090309459 - Ogashiwa; Toshinori ; et al.	2009-12-17
Method Of Bonding App 20090230172 - Ogashiwa; Toshinori ; et al.	2009-09-17
Semiconductor device having an aluminum alloy wiring line Grant 5,550,407 - Ogashiwa August 27, 1	1996-08-27
Alloy connecting materials for semiconductors Grant 5,366,692 - Ogashiwa November 22, 1	1994-11-22

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