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Entry sheet for drilling and method for drilling processing using same
Grant 11,383,307 - Kamei , et al. July 12, 2 | 2022-07-12 |
Method For Producing Package Substrate For Mounting Semiconductor Device
App 20220051958 - HIRANO; Syunsuke ; et al. | 2022-02-17 |
Method For Producing Package Substrate For Loading Semiconductor Device
App 20220020602 - HIRANO; Syunsuke ; et al. | 2022-01-20 |
Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor device
Grant 11,217,445 - Hirano , et al. January 4, 2 | 2022-01-04 |
Method for producing printed wiring board
Grant 11,197,379 - Kawashita , et al. December 7, 2 | 2021-12-07 |
Drill bit and hole formation method
Grant 11,097,357 - Matsuyama , et al. August 24, 2 | 2021-08-24 |
Supporting Substrate, Supporting Substrate-attached Laminate And Method For Manufacturing A Package Substrate For Mounting A Semiconductor Device
App 20210257207 - HIRANO; Syunsuke ; et al. | 2021-08-19 |
Support and method for producing semiconductor device-mounting substrate using the same
Grant 11,081,367 - Hirano , et al. August 3, 2 | 2021-08-03 |
Laminate, Metal Foil-clad Laminate, Laminate Having Patterned Metal Foil, Laminate Having Buildup Structure, Printed Wiring Board, Multilayer Coreless Substrate, And Method For Producing Same
App 20210204404 - HIRANO; Syunsuke ; et al. | 2021-07-01 |
Methods for producing laminate and substrate for mounting a semiconductor device
Grant 10,964,552 - Kato , et al. March 30, 2 | 2021-03-30 |
Method For Producing Laminate Having Patterned Metal Foil, And Laminate Having Patterned Metal Foil
App 20200388506 - HIRANO; Syunsuke ; et al. | 2020-12-10 |
Drill Bit And Hole Formation Method
App 20200282471 - MATSUYAMA; Yousuke ; et al. | 2020-09-10 |
Method for manufacturing package substrate for mounting a semiconductor device, and method for manufacturing semiconductor device mounting substrate
Grant 10,727,081 - Hirano , et al. | 2020-07-28 |
Entry sheet for drilling
Grant 10,674,609 - Matsuyama , et al. | 2020-06-02 |
Support And Method For Producing Semiconductor Device-mounting Substrate Using The Same
App 20200043752 - HIRANO; Syunsuke ; et al. | 2020-02-06 |
Method For Producing Printed Wiring Board
App 20200015363 - KAWASHITA; Kazuaki ; et al. | 2020-01-09 |
Entry sheet for drilling and method for drilling processing using same
Grant 10,486,324 - Kamei , et al. Nov | 2019-11-26 |
Entry sheet for drilling and method for drilling processing using same
Grant 10,478,991 - Kamei , et al. Nov | 2019-11-19 |
Drill Bit And Hole Formation Method
App 20190275593 - MATSUYAMA; Yousuke ; et al. | 2019-09-12 |
Lubricant material for assisting machining process and machining method
Grant 10,384,322 - Matsuyama , et al. A | 2019-08-20 |
Drill Bit And Hole Formation Method
App 20190184472 - MATSUYAMA; Yousuke ; et al. | 2019-06-20 |
Supporting Substrate, Supporting Substrate-attached Laminate And Method For Manufacturing A Package Substrate For Mounting A Sem
App 20190181000 - HIRANO; Syunsuke ; et al. | 2019-06-13 |
Method For Manufacturing Package Substrate For Mounting A Semiconductor Device, And Method For Manufacturing Semiconductor Devic
App 20190148169 - HIRANO; Syunsuke ; et al. | 2019-05-16 |
Resin composition, prepreg, and laminated sheet
Grant 10,212,813 - Ogashiwa , et al. Feb | 2019-02-19 |
Entry Sheet For Drilling And Method For Drilling Processing Using Same
App 20180257148 - KAMEI; Takayuki ; et al. | 2018-09-13 |
Lubricant Material For Assisting Machining Process And Machining Method
App 20180229339 - MATSUYAMA; Yousuke ; et al. | 2018-08-16 |
Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board
Grant 10,030,141 - Chiba , et al. July 24, 2 | 2018-07-24 |
Resin composition, prepreg and laminate
Grant 9,955,573 - Kato , et al. April 24, 2 | 2018-04-24 |
Resin composition, prepreg, laminate, and printed wiring board
Grant 9,902,851 - Takahashi , et al. February 27, 2 | 2018-02-27 |
Resin composition, prepreg, and laminated sheet
Grant 9,902,825 - Kato , et al. February 27, 2 | 2018-02-27 |
Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same
Grant 9,905,328 - Hasebe , et al. February 27, 2 | 2018-02-27 |
Entry Sheet For Drilling Holes, And Hole Drilling Method Using Same
App 20180050462 - KAMEI; Takayuki ; et al. | 2018-02-22 |
Entry Sheet For Drilling And Method For Drilling Processing Using Same
App 20180036898 - KAMEI; Takayuki ; et al. | 2018-02-08 |
Laminate And Substrate For Mounting A Semiconductor Device, And Methods For Producing The Same
App 20170213745 - KATO; Yoshihiro ; et al. | 2017-07-27 |
Entry Sheet For Drilling
App 20170111997 - MATSUYAMA; Yousuke ; et al. | 2017-04-20 |
Resin Composition, Prepreg, And Laminated Sheet
App 20170073485 - KATO; Yoshihiro ; et al. | 2017-03-16 |
Resin composition, prepreg, and laminate
Grant 9,480,164 - Ogashiwa , et al. October 25, 2 | 2016-10-25 |
Resin Composition For Printed Wiring Board Material And Prepreg, Resin Sheet, Metal Foil-clad Laminate, And Printed Wiring Board Using The Same
App 20160125971 - HASEBE; Keiichi ; et al. | 2016-05-05 |
Molybdenum compound powder, prepreg, and laminate
Grant 9,232,648 - Miyahira , et al. January 5, 2 | 2016-01-05 |
Resin Composition, Pre-preg, Laminate, Metal Foil-clad Laminate, And Printed Wiring Board
App 20150307708 - CHIBA; Tomo ; et al. | 2015-10-29 |
Resin Composition, Prepreg, Laminate, And Printed Wiring Board
App 20150267047 - Takahashi; Hiroshi ; et al. | 2015-09-24 |
Resin Composition, Prepreg, And Laminated Sheet
App 20150111044 - OGASHIWA; Takaaki ; et al. | 2015-04-23 |
Molybdenum Compound Powder, Prepreg, And Laminate
App 20140308489 - Miyahira; Tetsuro ; et al. | 2014-10-16 |
Resin Composition, Prepreg, And Laminate
App 20140227531 - Ogashiwa; Takaaki ; et al. | 2014-08-14 |
Resin Composition, Prepreg And Laminate
App 20140017502 - Kato; Yoshihiro ; et al. | 2014-01-16 |
Resin Composition, Prepreg, And Laminate
App 20130136930 - Kato; Yoshihiro ; et al. | 2013-05-30 |
Resin Composition, Prepreg, And Laminated Sheet
App 20130089743 - Ogashiwa; Takaaki ; et al. | 2013-04-11 |
Resin Composition, Prepreg, And Laminated Sheet
App 20130045650 - Ogashiwa; Takaaki ; et al. | 2013-02-21 |
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