Ogasa; Nobuo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ogasa; Nobuo.The latest application filed is for "forming a metallized layer on an aln substrate by applying and heating a paste of a metal composed of w and mo".
- Ogasa; Nobuo - Hyogo JP
- Ogasa; Nobuo - Itami JP
| Patent | Date |
|---|---|
| Forming a metallized layer on an AlN substrate by applying and heating a paste of a metal composed of W and Mo Grant 5,370,907 - Yamakawa , et al. December 6, 1 | 1994-12-06 |
| Ceramic circuit board and a method of manufacturing the ceramic circuit board Grant 5,229,549 - Yamakawa , et al. July 20, 1 | 1993-07-20 |
| Substrate for semiconductor apparatus Grant 5,099,310 - Osada , et al. * March 24, 1 | 1992-03-24 |
| Substrate for semiconductor apparatus having a composite material Grant 5,086,333 - Osada , et al. February 4, 1 | 1992-02-04 |
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