Oetjen; Jens

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oetjen; Jens.The latest application filed is for "enhanced solder pad".

Company Profile

3.5.5

Oetjen; Jens - Ottenhofen DE
Oetjen; Jens - Ottenhofen/Herdweg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto Grant 10,168,391 - Babulano , et al. J	2019-01-01
Enhanced solder pad Grant 10,121,753 - Oetjen , et al. November 6, 2	2018-11-06
Enhanced Solder Pad App 20180012854 - Oetjen; Jens ; et al.	2018-01-11
Power package with integrated magnetic field sensor Grant 9,564,423 - Chen , et al. February 7, 2	2017-02-07
Semiconductor package with integrated magnetic field sensor Grant 9,564,578 - Meyer , et al. February 7, 2	2017-02-07
Semiconductor Package with Integrated Magnetic Field Sensor App 20160380181 - Meyer; Thorsten ; et al.	2016-12-29
Multi-Functional Interconnect Module and Carrier with Multi-Functional Interconnect Module Attached Thereto App 20160377689 - Babulano; Giuliano Angelo ; et al.	2016-12-29
Power Package With Integrated Magnetic Field Sensor App 20160379966 - Chen; Liu ; et al.	2016-12-29
Method for testing a contact region of a semiconductor module Grant 7,265,564 - Otremba , et al. September 4, 2	2007-09-04
Method for testing a contact region of a semiconductor module App 20060066336 - Otremba; Ralf ; et al.	2006-03-30

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