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name:-0.014458894729614
name:-0.0027787685394287
Oehrlein; Gottlieb S. Patent Filings

Oehrlein; Gottlieb S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oehrlein; Gottlieb S..The latest application filed is for "leveraging precursor molecular composition and structure for atomic layer etching".

Company Profile
2.12.3
  • Oehrlein; Gottlieb S. - Clarksville MD
  • Oehrlein; Gottlieb S. - Voorheesville NY
  • Oehrlein; Gottlieb S. - Yorktown Heights NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Leveraging precursor molecular composition and structure for atomic layer etching
Grant 11,171,013 - Oehrlein , et al. November 9, 2
2021-11-09
Leveraging Precursor Molecular Composition and Structure for Atomic Layer Etching
App 20200335352 - Oehrlein; Gottlieb S. ;   et al.
2020-10-22
Achieving etching selectivity for atomic layer etching processes by utilizing material-selective deposition phenomena
Grant 10,790,157 - Oehrlein , et al. September 29, 2
2020-09-29
Reactor for plasma-based atomic layer etching of materials
Grant 9,620,382 - Oehrlein , et al. April 11, 2
2017-04-11
Reactor For Plasma-based Atomic Layer Etching Of Materials
App 20150162168 - OEHRLEIN; Gottlieb S. ;   et al.
2015-06-11
Method and system for nanoscale plasma processing of objects
Grant 7,470,329 - Oehrlein , et al. December 30, 2
2008-12-30
Method and system for nanoscale plasma processing of objects
App 20050051517 - Oehrlein, Gottlieb S. ;   et al.
2005-03-10
Highly selective chemical dry etching of silicon nitride over silicon and silicon dioxide
Grant 6,060,400 - Oehrlein , et al. May 9, 2
2000-05-09
Method for hot wall reactive ion etching using a dielectric or metallic liner with temperature control to achieve process stability
Grant 5,637,237 - Oehrlein , et al. June 10, 1
1997-06-10
Adhesion promotion of fluorocarbon films
Grant 5,549,935 - Nguyen , et al. August 27, 1
1996-08-27
Method for controlling silicon etch depth
Grant 5,395,769 - Arienzo , et al. March 7, 1
1995-03-07
Plasma deposition of fluorocarbon
Grant 5,302,420 - Nguyen , et al. April 12, 1
1994-04-12
Plasma deposition of fluorocarbon
Grant 5,244,730 - Nguyen , et al. September 14, 1
1993-09-14
High area capacitor formation using material dependent etching
Grant 5,155,657 - Oehrlein , et al. October 13, 1
1992-10-13
High area capacitor formation using dry etching
Grant 5,153,813 - Oehrlein , et al. October 6, 1
1992-10-06

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