Oe; Kunio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oe; Kunio.The latest application filed is for "component mounting apparatus and component mounting method".

Company Profile

0.8.4

Oe; Kunio - Hirakata JP
Oe; Kunio - Osaka JP
Oe; Kunio - Hirakata-shi JP
Oe; Kunio - Chiryu JP
Oe, Kunio - Chiryu-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Component mounting apparatus Grant 7,797,820 - Shida , et al. September 21, 2	2010-09-21
Component mounting apparatus and component mounting method App 20080163481 - Shida; Satoshi ; et al.	2008-07-10
Component mounting method Grant 7,353,596 - Shida , et al. April 8, 2	2008-04-08
Parts packaging device and parts packaging method App 20060185157 - Shida; Satoshi ; et al.	2006-08-24
Electric-component mounting system Grant 7,010,853 - Oe March 14, 2	2006-03-14
Device for removably mounting suction nozzle on nozzle holder Grant 6,705,000 - Oe March 16, 2	2004-03-16
Electric-component mounting system having device for changing spacing distance between mounting units of the system App 20020162676 - Oe, Kunio	2002-11-07
Device for removably mounting suction nozzle on nozzle holder App 20020046461 - Oe, Kunio	2002-04-25
Electronic-component removing system Grant 5,784,777 - Asai , et al. July 28, 1	1998-07-28
Transfer type circuit board fabricating system Grant 5,692,292 - Asai , et al. December 2, 1	1997-12-02
Method and apparatus for holding and centering electronic component Grant 4,515,507 - Asai , et al. May 7, 1	1985-05-07
Apparatus for automatically mounting non-lead electronic components on printed-circuit Grant 4,438,559 - Asai , et al. March 27, 1	1984-03-27

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