loadpatents
name:-0.15544104576111
name:-0.027388095855713
name:-0.00072002410888672
Odashima; Hitoshi Patent Filings

Odashima; Hitoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Odashima; Hitoshi.The latest application filed is for "rfid tag and manufacturing method thereof".

Company Profile
0.6.8
  • Odashima; Hitoshi - Yokohama JP
  • Odashima, Hitoshi - Yokohama-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device and its manufacturing method
Grant 7,265,035 - Honma , et al. September 4, 2
2007-09-04
RFID tag and manufacturing method thereof
App 20070007344 - Inoue; Kosuke ;   et al.
2007-01-11
Semiconductor device and its manufacturing method
App 20060252233 - Honma; Hiroshi ;   et al.
2006-11-09
Method and apparatus for separating semiconductor chips
App 20040083602 - Matsuoka, Makoto ;   et al.
2004-05-06
Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card
Grant 6,629,553 - Odashima , et al. October 7, 2
2003-10-07
Method and apparatus for separating semiconductor chips
Grant 6,602,736 - Matsuoka , et al. August 5, 2
2003-08-05
Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card
App 20020072202 - Odashima, Hitoshi ;   et al.
2002-06-13
Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card
App 20020046450 - Odashima, Hitoshi ;   et al.
2002-04-25
Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card
App 20020036895 - Odashima, Hitoshi ;   et al.
2002-03-28
Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card
App 20020024883 - Odashima, Hitoshi ;   et al.
2002-02-28
Thin electronic circuit component and method and apparatus for producing the same
App 20010050138 - Fujikawa, Keiji ;   et al.
2001-12-13
Thin electronic circuit component and method and apparatus for producing the same
Grant 6,203,655 - Fujikawa , et al. March 20, 2
2001-03-20
Minute particle loading method and apparatus
Grant 5,279,045 - Odashima , et al. January 18, 1
1994-01-18
Parts-connecting apparatus using solder
Grant 4,620,663 - Odashima , et al. November 4, 1
1986-11-04

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