Odaira; Hiroshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Odaira; Hiroshi.The latest application filed is for "wiring circuit board, manufacturing method for the wiring circuit board, and circuit module".

Company Profile

0.6.4

Odaira; Hiroshi - Kanagawa JP
Odaira, Hiroshi - Tokyo JP
Odaira; Hiroshi - Chigasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module App 20100242270 - Iijima; Tomoo ; et al.	2010-09-30
Member for Interconnecting Wiring Films and Method for Producing the Same App 20080264678 - lijima; Tomoo ; et al.	2008-10-30
Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board App 20050097727 - Iijima, Tomoo ; et al.	2005-05-12
Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module App 20040201096 - Iijima, Tomoo ; et al.	2004-10-14
Multilayer wiring board and method for forming the same Grant 6,010,769 - Sasaoka , et al. January 4, 2	2000-01-04
IC package having a single wiring sheet with a lead pattern disposed thereon Grant 5,973,395 - Suzuki , et al. October 26, 1	1999-10-26
Circuit devices and fabrication Method of the same Grant 5,822,850 - Odaira , et al. October 20, 1	1998-10-20
Circuit devices and fabrication method of the same Grant 5,600,103 - Odaira , et al. February 4, 1	1997-02-04
Wiring boards and manufacturing methods thereof Grant 5,310,966 - Iida , et al. May 10, 1	1994-05-10
Fixing device for electronic duplicator machine Grant 4,395,109 - Nakajima , et al. July 26, 1	1983-07-26

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