ODAGAKI; Mitsuko
Patent Applications and Registrations
Patent applications and USPTO patent grants for ODAGAKI; Mitsuko.The latest application filed is for "plating apparatus".
- ODAGAKI; Mitsuko - Kanagawa-ken JP
- Odagaki; Mitsuko - Yokohama JP
- Odagaki; Mitsuko - Yokohama-shi JP
| Patent | Date |
|---|---|
| Plating Apparatus App 20080296165 - KUNISAWA; Junji ; et al. | 2008-12-04 |
| Plating Apparatus App 20080251385 - Kunisawa; Junji ; et al. | 2008-10-16 |
| Method of performing electrolytic treatment on a conductive layer of a substrate Grant 7,387,717 - Kunisawa , et al. June 17, 2 | 2008-06-17 |
| Substrate processing apparatus and substrate plating apparatus Grant 7,208,074 - Mishima , et al. April 24, 2 | 2007-04-24 |
| Substrate processing apparatus and substrate plating apparatus App 20060027452 - Mishima; Koji ; et al. | 2006-02-09 |
| Substrate processing apparatus and substrate plating apparatus App 20040134789 - Mishima, Koji ; et al. | 2004-07-15 |
| Plating apparatus App 20040069646 - Kunisawa, Junji ; et al. | 2004-04-15 |
| Substrate processing apparatus and substrate plating apparatus Grant 6,689,257 - Mishima , et al. February 10, 2 | 2004-02-10 |
| Plating apparatus Grant 6,632,335 - Kunisawa , et al. October 14, 2 | 2003-10-14 |
| Plating apparatus and plating method for substrate App 20020020627 - Kunisawa, Junji ; et al. | 2002-02-21 |
| Substrate processing apparatus and substrate plating apparatus App 20020000371 - Mishima, Koji ; et al. | 2002-01-03 |
| Semiconductor substrate processing apparatus and method App 20010024691 - Kimura, Norio ; et al. | 2001-09-27 |
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