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name:-0.0084450244903564
name:-0.00058317184448242
Oda; Hidemasa Patent Filings

Oda; Hidemasa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oda; Hidemasa.The latest application filed is for "polyvinyl acetal resin film and multilayer structure articles using the same".

Company Profile
0.7.2
  • Oda; Hidemasa - Tokyo JP
  • Oda; Hidemasa - Kurashiki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Polyvinyl acetal resin film and multilayer structure articles using the same
Grant 9,431,560 - Oda , et al. August 30, 2
2016-08-30
Polyvinyl Acetal Resin Film And Multilayer Structure Articles Using The Same
App 20140020759 - Oda; Hidemasa ;   et al.
2014-01-23
Multilayered container and package utilizing the same
Grant 5,221,566 - Tokoh , et al. June 22, 1
1993-06-22
Multilayered packaging materials having high gas barrier property
Grant 5,069,946 - Moritani , et al. December 3, 1
1991-12-03
Multilayered packaging materials having high gas barrier property
Grant 4,999,229 - Moritani , et al. March 12, 1
1991-03-12
Multilayered container
Grant 4,960,639 - Oda , et al. October 2, 1
1990-10-02
Heat resistant container
Grant 4,929,482 - Moritani , et al. May 29, 1
1990-05-29

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