Patent | Date |
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Encryption Key Generation App 20200344170 - OCHI; Takao ;   et al. | 2020-10-29 |
Information communication system, information communication method and device Grant 10,735,328 - Ochi , et al. | 2020-08-04 |
Information Communication System, Information Communication Method And Device App 20170237666 - OCHI; Takao ;   et al. | 2017-08-17 |
Machining apparatus for machining end face of tapered roller and grinding wheel body Grant 9,605,714 - Sakane , et al. March 28, 2 | 2017-03-28 |
Semiconductor apparatus including a heat dissipating member Grant 9,437,517 - Ochi September 6, 2 | 2016-09-06 |
Semiconductor Device Having Heat Dissipation Structure And Laminate Of Semiconductor Devices App 20160035647 - OCHI; TAKAO | 2016-02-04 |
Semiconductor Apparatus Including A Heat Dissipating Member App 20150303125 - OCHI; TAKAO | 2015-10-22 |
Machining Apparatus For Machining End Face Of Tapered Roller And Grinding Wheel Body App 20150285303 - SAKANE; Munesato ;   et al. | 2015-10-08 |
Semiconductor Device, Semiconductor Package, And Method For Manufacturing Semiconductor Device App 20120175788 - OCHI; Takao | 2012-07-12 |
Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same Grant 8,125,079 - Ito , et al. February 28, 2 | 2012-02-28 |
Circuit board, lead frame, semiconductor device, and method for fabricating the same Grant 8,039,941 - Ochi October 18, 2 | 2011-10-18 |
Storing tray and storing device Grant 7,882,957 - Ochi February 8, 2 | 2011-02-08 |
Circuit Board, Lead Frame, Semiconductor Device, And Method For Fabricating The Same App 20090289347 - Ochi; Takao | 2009-11-26 |
Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device Grant 7,482,701 - Ito , et al. January 27, 2 | 2009-01-27 |
Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device App 20080036069 - Ito; Tetsuo ;   et al. | 2008-02-14 |
Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molidng semiconductor device App 20080029930 - Ito; Tetsuo ;   et al. | 2008-02-07 |
Card-type circuit device Grant 7,268,417 - Ochi , et al. September 11, 2 | 2007-09-11 |
Semiconductor device and method for fabricating the same Grant 7,154,189 - Maeda , et al. December 26, 2 | 2006-12-26 |
Electronic circuit device Grant 7,149,091 - Ochi , et al. December 12, 2 | 2006-12-12 |
Information storage semiconductor element Grant D525,214 - Ochi , et al. July 18, 2 | 2006-07-18 |
Information storage semiconductor element Grant D522,978 - Ochi , et al. June 13, 2 | 2006-06-13 |
Storing tray and storing device App 20060054532 - Ochi; Takao | 2006-03-16 |
Semiconductor device and method for fabricating the same Grant 6,905,912 - Maeda , et al. June 14, 2 | 2005-06-14 |
Semiconductor device and method for fabricating the same App 20050121761 - Maeda, Kenji ;   et al. | 2005-06-09 |
Electronic circuit device App 20040212061 - Ochi, Takao ;   et al. | 2004-10-28 |
Semiconductor memory element Grant D487,430 - Asaka , et al. March 9, 2 | 2004-03-09 |
Electronic circuit device App 20030227025 - Ochi, Takao ;   et al. | 2003-12-11 |
Semiconductor device and method for fabricating the same App 20030207492 - Maeda, Kenji ;   et al. | 2003-11-06 |
Semiconductor device and method for fabricating the same Grant 6,582,991 - Maeda , et al. June 24, 2 | 2003-06-24 |
Semiconductor device having a lead clamping arrangement Grant 5,998,866 - Ochi , et al. December 7, 1 | 1999-12-07 |
Lead frame and method of mounting semiconductor chip Grant 5,708,293 - Ochi , et al. January 13, 1 | 1998-01-13 |