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name:-0.026637077331543
name:-0.02165699005127
name:-0.0028018951416016
OCHI; Takao Patent Filings

OCHI; Takao

Patent Applications and Registrations

Patent applications and USPTO patent grants for OCHI; Takao.The latest application filed is for "encryption key generation".

Company Profile
2.17.14
  • OCHI; Takao - Tokyo JP
  • Ochi; Takao - Kizugawa JP
  • Ochi; Takao - Niigata JP
  • OCHI; Takao - Kizugawa-shi JP
  • OCHI; Takao - Shiga JP
  • Ochi; Takao - Shiga-gun JP
  • Ochi; Takao - Osaka JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Encryption Key Generation
App 20200344170 - OCHI; Takao ;   et al.
2020-10-29
Information communication system, information communication method and device
Grant 10,735,328 - Ochi , et al.
2020-08-04
Information Communication System, Information Communication Method And Device
App 20170237666 - OCHI; Takao ;   et al.
2017-08-17
Machining apparatus for machining end face of tapered roller and grinding wheel body
Grant 9,605,714 - Sakane , et al. March 28, 2
2017-03-28
Semiconductor apparatus including a heat dissipating member
Grant 9,437,517 - Ochi September 6, 2
2016-09-06
Semiconductor Device Having Heat Dissipation Structure And Laminate Of Semiconductor Devices
App 20160035647 - OCHI; TAKAO
2016-02-04
Semiconductor Apparatus Including A Heat Dissipating Member
App 20150303125 - OCHI; TAKAO
2015-10-22
Machining Apparatus For Machining End Face Of Tapered Roller And Grinding Wheel Body
App 20150285303 - SAKANE; Munesato ;   et al.
2015-10-08
Semiconductor Device, Semiconductor Package, And Method For Manufacturing Semiconductor Device
App 20120175788 - OCHI; Takao
2012-07-12
Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same
Grant 8,125,079 - Ito , et al. February 28, 2
2012-02-28
Circuit board, lead frame, semiconductor device, and method for fabricating the same
Grant 8,039,941 - Ochi October 18, 2
2011-10-18
Storing tray and storing device
Grant 7,882,957 - Ochi February 8, 2
2011-02-08
Circuit Board, Lead Frame, Semiconductor Device, And Method For Fabricating The Same
App 20090289347 - Ochi; Takao
2009-11-26
Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device
Grant 7,482,701 - Ito , et al. January 27, 2
2009-01-27
Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device
App 20080036069 - Ito; Tetsuo ;   et al.
2008-02-14
Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molidng semiconductor device
App 20080029930 - Ito; Tetsuo ;   et al.
2008-02-07
Card-type circuit device
Grant 7,268,417 - Ochi , et al. September 11, 2
2007-09-11
Semiconductor device and method for fabricating the same
Grant 7,154,189 - Maeda , et al. December 26, 2
2006-12-26
Electronic circuit device
Grant 7,149,091 - Ochi , et al. December 12, 2
2006-12-12
Information storage semiconductor element
Grant D525,214 - Ochi , et al. July 18, 2
2006-07-18
Information storage semiconductor element
Grant D522,978 - Ochi , et al. June 13, 2
2006-06-13
Storing tray and storing device
App 20060054532 - Ochi; Takao
2006-03-16
Semiconductor device and method for fabricating the same
Grant 6,905,912 - Maeda , et al. June 14, 2
2005-06-14
Semiconductor device and method for fabricating the same
App 20050121761 - Maeda, Kenji ;   et al.
2005-06-09
Electronic circuit device
App 20040212061 - Ochi, Takao ;   et al.
2004-10-28
Semiconductor memory element
Grant D487,430 - Asaka , et al. March 9, 2
2004-03-09
Electronic circuit device
App 20030227025 - Ochi, Takao ;   et al.
2003-12-11
Semiconductor device and method for fabricating the same
App 20030207492 - Maeda, Kenji ;   et al.
2003-11-06
Semiconductor device and method for fabricating the same
Grant 6,582,991 - Maeda , et al. June 24, 2
2003-06-24
Semiconductor device having a lead clamping arrangement
Grant 5,998,866 - Ochi , et al. December 7, 1
1999-12-07
Lead frame and method of mounting semiconductor chip
Grant 5,708,293 - Ochi , et al. January 13, 1
1998-01-13

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