loadpatents
name:-0.035872936248779
name:-0.016649961471558
name:-0.0046401023864746
Ochi; Shozo Patent Filings

Ochi; Shozo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ochi; Shozo.The latest application filed is for "semiconductor device and method of manufacturing the same".

Company Profile
4.16.25
  • Ochi; Shozo - Osaka JP
  • Ochi; Shozo - Takatsuki-shi JP
  • Ochi; Shozo - Takatsuki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Solid-state imaging device having electronic components mounted between a main substrate and an imaging element
Grant 11,381,767 - Itoi , et al. July 5, 2
2022-07-05
Semiconductor Device And Method Of Manufacturing The Same
App 20220045027 - OCHI; SHOZO ;   et al.
2022-02-10
Method for manufacturing semiconductor device
Grant 10,790,250 - Sakurai , et al. September 29, 2
2020-09-29
Solid-state Imaging Device
App 20200195867 - ITOI; KIYOKAZU ;   et al.
2020-06-18
Optical module structure
Grant 10,365,446 - Ochi , et al. July 30, 2
2019-07-30
Method For Manufacturing Semiconductor Device
App 20190181110 - SAKURAI; Daisuke ;   et al.
2019-06-13
Optical Module Structure
App 20190137708 - OCHI; Shozo ;   et al.
2019-05-09
Electronic component implementing structure intermediate body, electronic component implementing structure body and manufacturing method of electronic component implementing structure body
Grant 9,041,221 - Ochi , et al. May 26, 2
2015-05-26
Component built-in module, and manufacturing method for component built-in module
Grant 8,745,859 - Ochi , et al. June 10, 2
2014-06-10
Intermediate For Electronic Component Mounting Structure, Electronic Component Mounting Structure, And Method For Manufacturing Electronic Component Mounting Structure
App 20130277862 - Ochi; Shozo ;   et al.
2013-10-24
Component Built-in Module, And Manufacturing Method For Component Built-in Module
App 20120293965 - OCHI; Shozo ;   et al.
2012-11-22
Semiconductor memory module incorporating antenna
Grant 8,031,127 - Ochi , et al. October 4, 2
2011-10-04
Antenna built-in module, card type information device, and methods for manufacturing them
Grant 8,025,237 - Ochi , et al. September 27, 2
2011-09-27
Storage medium with built-in antenna
Grant 7,924,228 - Ochi , et al. April 12, 2
2011-04-12
Card type information device and method for manufacturing same
Grant 7,775,446 - Ochi , et al. August 17, 2
2010-08-17
Antenna Built-in Module, Card Type Information Device, And Methods For Manufacturing Them
App 20100163630 - Ochi; Shozo ;   et al.
2010-07-01
Storage Medium With Built-in Antenna
App 20100052996 - Ochi; Shozo ;   et al.
2010-03-04
Conductive Bump, Method For Forming The Same, And Electronic Component Mounting Structure Using The Same
App 20090301771 - Ochi; Shozo ;   et al.
2009-12-10
Electronic Component Forming Apparatus, Electronic Component Formed With It And Forming Method Thereof
App 20090286173 - Ushirokawa; Kazuya ;   et al.
2009-11-19
Electronic Component Mounted Structure And Method Of Manufacturing The Same
App 20090246474 - Sakurai; Daisuke ;   et al.
2009-10-01
Card Type Information Device And Method For Manufacturing Same
App 20090173795 - Ochi; Shozo ;   et al.
2009-07-09
Electronic Circuit Module With Built-in Antenna And Method For Manufacturing The Same
App 20090051606 - Ochi; Shozo ;   et al.
2009-02-26
Semiconductor Memory Module Incorporating Antenna
App 20090040734 - Ochi; Shozo ;   et al.
2009-02-12
Multi-layer Circuit Substrate Manufacturing Method And Multi-layer Circuit Substrate
App 20090032285 - Ueda; Yoji ;   et al.
2009-02-05
Semiconductor memory module having built-in antenna
Grant 7,471,260 - Ochi , et al. December 30, 2
2008-12-30
Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment
App 20080185178 - Okimoto; Rikiya ;   et al.
2008-08-07
Semiconductor Memory Module Having Built-In Antenna
App 20080111756 - Ochi; Shozo ;   et al.
2008-05-15
Method for manufacturing printed circuit board
Grant 7,155,820 - Andoh , et al. January 2, 2
2007-01-02
Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment
App 20050124197 - Okimoto, Rikiya ;   et al.
2005-06-09
Prepreg for printed wiring board, printed wiring board using the prepreg and method for manufacturing the printed wiring board, and multilayer printed wiring board and method for manufacturing the multilayer printed wiring board
App 20050014035 - Nakagiri, Yasushi ;   et al.
2005-01-20
Printed circuit board and method for producing the same
Grant 6,799,369 - Ochi , et al. October 5, 2
2004-10-05
Printed circuit board and method of manufacturing the same
Grant 6,753,483 - Andoh , et al. June 22, 2
2004-06-22
Printed circuit board and method of manufacturing the same
App 20040089471 - Andoh, Daizo ;   et al.
2004-05-13
Printed wiring board and method of manufacturing the same
App 20030137815 - Ochi, Shozo ;   et al.
2003-07-24
Printed circuit board and method for producing the same
App 20020192485 - Ochi, Shozo ;   et al.
2002-12-19
Printed circuit board and method for producing the same
Grant 6,459,046 - Ochi , et al. October 1, 2
2002-10-01
Printed circuit board and method for producing the same
App 20020023777 - Ochi, Shozo ;   et al.
2002-02-28
Printed circuit board and method of manufacturing the same
App 20010052425 - Andoh, Daizo ;   et al.
2001-12-20

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