OCHI; Shinji

Patent Applications and Registrations

Patent applications and USPTO patent grants for OCHI; Shinji.The latest application filed is for "active material sheet and electrode using the same".

Company Profile

0.9.9

OCHI; Shinji - Inuyama-shi JP
Ochi; Shinji - Inuyama N/A JP
Ochi; Shinji - Takatsuki JP
Ochi; Shinji - Osaka JP
Ochi; Shinji - Takatsuki-shi JP
Ochi; Shinji - Yokohama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Active Material Sheet And Electrode Using The Same App 20140011087 - OZAKI; Kouki ; et al.	2014-01-09
Electrode App 20130236782 - OZAKI; Kouki ; et al.	2013-09-12
Sliding bearing used in turbocharger of internal combustion engine Grant 8,388,228 - Toda , et al. March 5, 2	2013-03-05
Shoe bottom repair agent and shoe bottom repair set utilizing the same Grant 8,082,616 - Tameno , et al. December 27, 2	2011-12-27
Sliding member and process for formation of its coating layer Grant 8,012,569 - Ochi , et al. September 6, 2	2011-09-06
Sliding Bearing Used In Turbocharger Of Internal Combustion Engine App 20110211781 - TODA; Kazuaki ; et al.	2011-09-01
Multi-layer sliding member, and method for forming coating layer of sliding member Grant 7,833,609 - Fujita , et al. November 16, 2	2010-11-16
Shoe bottom repair agent and shoe bottom repair set utilizing the same App 20090077757 - Tameno; Norihiro ; et al.	2009-03-26
Sliding member and process for formation of its coating layer App 20070231564 - Ochi; Shinji ; et al.	2007-10-04
Multi-layer sliding member, and method for forming coating layer of sliding member App 20070116936 - Fujita; Masahito ; et al.	2007-05-24
Slide bearing for internal combustion engines App 20070031651 - Kagohara; Yukihiko ; et al.	2007-02-08
One-pack hardening paste material for use in foaming machine App 20060148909 - Takada; Masaharu ; et al.	2006-07-06
Moisture-curing one-pack urethane adhesive compositions App 20040143055 - Nakata, Yoshihiro ; et al.	2004-07-22
Moisture-curable one-pack-type urethane adhesive composition Grant 6,657,035 - Nakata , et al. December 2, 2	2003-12-02
Semiconductor integrated circuit for suppressing overshooting and ringing Grant 5,680,068 - Ochi , et al. October 21, 1	1997-10-21
CMOS output buffer with pre-drive circuitry to control slew rate of main drive transistors Grant 5,216,293 - Sei , et al. June 1, 1	1993-06-01
Buffer circuit having a voltage drop means for the purpose of reducing peak current and through-current Grant 5,117,131 - Ochi , et al. May 26, 1	1992-05-26

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