Ochi; Koshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ochi; Koshi.The latest application filed is for "conductive composition and conductive molded body using same".

Company Profile

0.2.7

Ochi; Koshi - Hyogo JP
Ochi; Koshi - Kanagawa JP
Ochi, Koshi - Hiratsuka-shi JP
Ochi, Koshi - Kanagawa-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Conductive Composition And Conductive Molded Body Using Same App 20150252224 - Iseda; Taisuke ; et al.	2015-09-10
Method for clarifying exhaust gas Grant 7,300,640 - Ohtsuka , et al. November 27, 2	2007-11-27
Processing method of exhaust gas and processing apparatus of exhaust gas App 20060075895 - Shimada; Takashi ; et al.	2006-04-13
Processing method of gas and processing apparatus of gas App 20060018814 - Shimada; Takashi ; et al.	2006-01-26
Decompositionally treating agent and decompositionally treating method for fluorocarbons Grant 6,960,552 - Otsuka , et al. November 1, 2	2005-11-01
Ingredient and process for producing copper (I) chloride, adsorbent and adsorbing method for reductive gas each with the use of copper (I) chloride, and recovering method of carbon monoxide gas App 20050217483 - Shimada, Takashi ; et al.	2005-10-06
Method for clarifying exhaust gas App 20050201915 - Ohtsuka, Kenji ; et al.	2005-09-15
Decompositionally treating agent and decompositionally treating method for fluorocarbons App 20030139639 - Otsuka, Kenji ; et al.	2003-07-24
Heating packet App 20010010847 - Otsuka, Kenji ; et al.	2001-08-02

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