Ocasio; Jose M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ocasio; Jose M..The latest application filed is for "wafer edge cleaning utilizing polish pad material".
- Ocasio; Jose M. - Maybrook NY
| Patent | Date |
|---|---|
| Wafer edge cleaning utilizing polish pad material Grant 6,837,777 - Ziemins , et al. January 4, 2 | 2005-01-04 |
| Wafer edge cleaning utilizing polish pad material App 20040000326 - Ziemins, Uldis A. ; et al. | 2004-01-01 |
| Wafer edge cleaning utilizing polish pad material Grant 6,622,334 - Ziemins , et al. September 23, 2 | 2003-09-23 |
| Apparatus and method for front side chemical mechanical planarization (CMP) of semiconductor workpieces Grant 6,620,029 - Khoury , et al. September 16, 2 | 2003-09-16 |
| Apparatus And Method For Front Side Chemical Mechanical Planarization (cmp) Of Semiconductor Workpieces App 20030143930 - Khoury, Raymond M. ; et al. | 2003-07-31 |
| Real-time method for profiling and conditioning chemical-mechanical polishing pads Grant 6,343,974 - Fran.cedilla.a , et al. February 5, 2 | 2002-02-05 |
| Light energy cleaning of polishing pads Grant 6,217,422 - Franca , et al. April 17, 2 | 2001-04-17 |
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