Oberson; Valerie A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oberson; Valerie A..The latest application filed is for "direct bonded heterogeneous integration packaging structures".

Company Profile

1.8.8

Oberson; Valerie A. - St-Alphonse de Granby CA
Oberson; Valerie A. - Quebec CA
Oberson; Valerie A - Quebec CA
Oberson; Valerie A. - Alphonse de Granby CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Direct bonded heterogeneous integration packaging structures Grant 11,177,217 - Sikka , et al. November 16, 2	2021-11-16
Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity Grant 10,699,972 - Bernier , et al.	2020-06-30
Direct Bonded Heterogeneous Integration Packaging Structures App 20200144187 - Sikka; Kamal K. ; et al.	2020-05-07
Direct bonded heterogeneous integration packaging structures Grant 10,580,738 - Sikka , et al.	2020-03-03
Direct Bonded Heterogeneous Integration Packaging Structures App 20190295952 - Sikka; Kamal K. ; et al.	2019-09-26
Flat Laminate, Symmetrical Test Structures And Method Of Use To Gauge White Bump Sensitivity App 20180082912 - Bernier; William E. ; et al.	2018-03-22
Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity Grant 9,899,279 - Bernier , et al. February 20, 2	2018-02-20
Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity Grant 8,957,531 - Bernier , et al. February 17, 2	2015-02-17
Flat Laminate, Symmetrical Test Structures And Method Of Use To Gauge White Bump Sensitivity App 20150036716 - Bernier; William E. ; et al.	2015-02-05
Flat Laminate, Symmetrical Test Structures and Method of Use To Gauge White Bump Sensitivity App 20130098176 - Bernier; William E. ; et al.	2013-04-25
Optimization of metallurgical properties of a solder joint Grant 8,197,612 - Busby , et al. June 12, 2	2012-06-12
Structure of UBM and solder bumps and methods of fabrication Grant 8,003,512 - Belanger , et al. August 23, 2	2011-08-23
Novel Structure Of Ubm And Solder Bumps And Methods Of Fabrication App 20100193949 - Belanger; Luc L. ; et al.	2010-08-05
Optimization Of Metallurgical Properties Of A Solder Joint App 20090266447 - BUSBY; JAMES A. ; et al.	2009-10-29

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.