| Patent | Date |
|---|
Authentication article and process for making same
Grant 10,152,666 - Obeng , et al. Dec | 2018-12-11 |
Authentication Article And Process For Making Same
App 20150363682 - Obeng; Yaw S. ; et al. | 2015-12-17 |
FUSI integration method using SOG as a sacrificial planarization layer
Grant 7,943,499 - Lu , et al. May 17, 2 | 2011-05-17 |
FUSI integration method using SOG as a sacrificial planarization layer
Grant 7,732,312 - Lu , et al. June 8, 2 | 2010-06-08 |
FUSI integration method using SOG as a sacrificial planarization layer
Grant 7,732,313 - Lu , et al. June 8, 2 | 2010-06-08 |
Method for cleaning post-etch noble metal residues
Grant 7,723,199 - Obeng , et al. May 25, 2 | 2010-05-25 |
Method for reliably removing excess metal during metal silicide formation
Grant 7,700,481 - Obeng , et al. April 20, 2 | 2010-04-20 |
Method of manufacturing metal silicide contacts
Grant 7,670,952 - Obeng , et al. March 2, 2 | 2010-03-02 |
FUSI Integration Method Using SOG as a Sacrificial Planarization Layer
App 20100041231 - Lu; Jiong-Ping ; et al. | 2010-02-18 |
Process Method To Fabricate Cmos Circuits With Dual Stress Contact Etch-stop Liner Layers
App 20090020791 - Yu; Shaofeng ; et al. | 2009-01-22 |
Method For Reliably Removing Excess Metal During Metal Silicide Formation
App 20080315322 - Obeng; Yaw S. ; et al. | 2008-12-25 |
Method Of Manufacturing Metal Silicide Contacts
App 20080230846 - Obeng; Yaw S. ; et al. | 2008-09-25 |
Method For Cleaning Post-etch Noble Metal Residues
App 20070298521 - Obeng; Yaw S. ; et al. | 2007-12-27 |
FUSI integration method using SOG as a sacrificial planarization layer
App 20070173047 - Lu; Jiong-Ping ; et al. | 2007-07-26 |
Process For Selectively Removing Dielectric Material in the Presence of Metal Silicide
App 20070161246 - Obeng; Yaw S. ; et al. | 2007-07-12 |
Compacted polishing pads for improved chemical mechanical polishing longevity
Grant 7,059,946 - Obeng , et al. June 13, 2 | 2006-06-13 |
Chemical mechanical polishing pad and method for selective metal and barrier polishing
App 20050266226 - Obeng, Yaw S. | 2005-12-01 |
System and method for monitoring quality control of chemical mechanical polishing pads
App 20050153631 - Obeng, Yaw S. | 2005-07-14 |
Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
App 20050095865 - Obeng, Yaw S. ; et al. | 2005-05-05 |
Polishing pad for chemical mechanical polishing
App 20050055885 - Obeng, Yaw S. | 2005-03-17 |
Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
Grant 6,846,225 - Obeng , et al. January 25, 2 | 2005-01-25 |
Polishing pad resistant to delamination
Grant 6,838,169 - Obeng January 4, 2 | 2005-01-04 |
Method for preparing a polymer for chemical mechanical polishing
Grant 6,821,570 - Obeng , et al. November 23, 2 | 2004-11-23 |
Thermal management with filled polymeric polishing pads and applications therefor
Grant 6,818,301 - Obeng , et al. November 16, 2 | 2004-11-16 |
Polishing pad resistant to delamination
App 20040146712 - Obeng, Yaw S. | 2004-07-29 |
Polishing pad composition and method of use
Grant 6,764,574 - Obeng , et al. July 20, 2 | 2004-07-20 |
Corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces
App 20040132308 - Obeng, Yaw S. | 2004-07-08 |
Measuring the surface properties of polishing pads using ultrasonic reflectance
App 20040110449 - Obeng, Yaw S. | 2004-06-10 |
Polishing pad support that improves polishing performance and longevity
Grant 6,706,383 - Obeng , et al. March 16, 2 | 2004-03-16 |
Substrate polishing device and method
Grant 6,688,956 - Yokley , et al. February 10, 2 | 2004-02-10 |
Measuring the surface properties of polishing pads using ultrasonic reflectance
Grant 6,684,704 - Obeng February 3, 2 | 2004-02-03 |
Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
App 20030077436 - Obeng, Yaw S. ; et al. | 2003-04-24 |
Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
App 20030035940 - Obeng, Yaw S. ; et al. | 2003-02-20 |
Thermal management with filled polymeric polishing pads and applications therefor
App 20030031876 - Obeng, Yaw S. ; et al. | 2003-02-13 |
Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
App 20030021980 - Obeng, Yaw S. ; et al. | 2003-01-30 |
Polishing pad having a water-repellant film theron and a method of manufacture therefor
Grant 6,439,968 - Obeng August 27, 2 | 2002-08-27 |
Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
App 20020115734 - Obeng, Yaw S. ; et al. | 2002-08-22 |
Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
App 20020102924 - Obeng, Yaw S. ; et al. | 2002-08-01 |
Method of improving electromigration in semiconductor device manufacturing processes
Grant 6,365,503 - Huang , et al. April 2, 2 | 2002-04-02 |
Method of planarizing a surface on a semiconductor wafer
Grant 6,083,838 - Burton , et al. July 4, 2 | 2000-07-04 |
Integrated circuit manufacturing
Grant 5,417,802 - Obeng May 23, 1 | 1995-05-23 |
| 